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Datasheet: D2511 (TriQuint Semiconductor)

1.5 µm Laser ISOlated DFB Module ; Applications = Sonet/sdh up to OC-48/STM-16 ; Bandwidth = 2.488 Gb/s NRZ

 

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TriQuint Semiconductor

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1.5
m D2500-Type Digital
Isolated DFB Laser Module
Data Sheet, Rev. 1
February 2003
TriQuint Optoelectronics
The 1.5 m D2500-Type Laser Module is offered in a 14-pin,
hermetic, butterfly package.
Features
Integrated optical isolator
SONET/SDH compatible up to OC-48/STM-16
High-performance, multiquantum-well (MQW), dis-
tributed-feedback (DFB) laser
Low dispersion penalty for long-reach and
extended-reach applications
Industry-standard, 14-pin butterfly package
Characterized at 2.488 Gb/s (NRZ)
Wide operating case temperature range of
40 C to +70 C
InGaAs, PIN photodetector back-facet monitor
Low threshold current
High reliability
High optical power available
Qualified to meet the intent of Telcordia Technolo-
gies
TM
468
Applications
Telecommunications:
-- SONET/SDH
-- Long reach
-- Interexchange
Digital video
D2500
riQ
T uint
SEMICD
NDUCTO
R
DFB La
ser Mod
ule
2
2
For additional information and latest specifications, see our website: www.triquint.com
1.5 m D2500-Type Digital
Data Sheet, Rev. 1
Isolated DFB Laser Module
February 2003
Description
The D2500-type digital isolated DFB laser module con-
tains an internally cooled, InGaAsP, MQW, distributed-
feedback (DFB) laser designed for 1.5
m applications.
The laser is designed to be used in OC-12/STM-4
(622 Mb/s) and OC-48/STM-16 (2.488 Gb/s) for long-
reach and extended-reach applications. It is also capa-
ble of low dispersion penalties (<2 dB) for use with fiber
spans exceeding 170 km (3000 ps/nm).
The device is available with an average output power
of 0 dBm (3 dBm peak), which meets the SONET/SDH
standard. To eliminate the need for optical amplifiers in
some applications, the module can also be ordered
with higher output powers.
Controlled Feedback
The module contains an internal optical isolator that
suppresses optical feedback in laser-based, fiber-optic
systems. Light reflected back to the laser is attenuated
a minimum of 30 dB.
Controlled Temperature
An integral thermoelectric cooler (TEC) provides stable
thermal characteristics. The TEC allows for heating
and cooling of the laser chip to maintain a temperature
of 25 C for case temperatures from 40 C to +70 C.
The laser temperature is monitored by the internal ther-
mistor, which can be used with external circuitry to con-
trol the laser chip temperature.
Controlled Power
An internal, InGaAs, PIN photodiode functions as the
back-facet monitor. The photodiode monitors emission
from the rear facet of the laser and, when used in con-
junction with control circuitry, can control optical power
launched into the fiber. Normally, this configuration is
used in a feedback arrangement to maintain the aver-
age laser output power.
Standard Package
The laser module is fabricated in a 14-pin, hermetic,
metal/ceramic butterfly package. The package also
incorporates a bias tee that separates the dc-bias path
from the RF input. The RF input has a nominal 25
impedance. The laser module is equipped with a sin-
gle-mode fiber with an 8
m core and 125 m cladding.
The minimum pigtail length is 39.4 in. (100 cm); the
minimum bend radius is 1.23 in. (31.25 mm).
The pigtail is a 900
m tight buffer fiber. Various con-
nector and pigtail options are available.
Optoelectronic components produced by TriQuint are
qualified to rigorous internal standards that are consis-
tent with Telcordia Technologies TR-NWT-000468. All
design and manufacturing operations are ISO
9001
certified. The module is fully qualified for central office
applications.
Pin Information
* A positive current through the thermoelectric heat pump cools the
laser.
Both leads should be grounded for optimum performance.
Top view.
Figure 1. Circuit Schematic
Pin
Name
1
Thermistor
2
Thermistor
3
Laser dc Bias (cathode) ()
4
Back-facet Monitor Anode ()
5
Back-facet Monitor Cathode (+)
6
Thermoelectric Cooler (+)*
7
Thermoelectric Cooler ()*
8
Case Ground
9
Case Ground
10
Case Ground
11
Laser Anode (+)
12
RF Laser Input Cathode ()
13
Laser Anode (+)
14
Case Ground
1-567
TEC
L1
160 nH
ISOLATOR
R1
20
PACKAGE
GROUNDS
+
+
c
+
+
7
6
5
4
3
2
1
8
9
10
11
12
13
TH
10 k
NC
14
For additional information and latest specifications, see our website: www.triquint.com
3
.
Data Sheet, Rev. 1
1.5 m D2500-Type Digital
February 2003
Isolated DFB Laser Module
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the performance characteristics of the data sheet. Exposure to absolute maximum ratings for
extended periods can adversely affect device reliability.
* Does not apply to shipping container.
Parameter
Symbol
Min
Max
Unit
Laser Reverse Voltage
V
RLMAX
--
2
V
dc Forward Current
I
FLMAX
--
150
mA
Operating Case Temperature Range
T
C
40
70
C
Storage Case Temperature Range*
T
stg
40
85
C
Photodiode Reverse Voltage
V
RPDMAX
--
10
V
Photodiode Forward Current
I
FPDMAX
--
1
mA
Handling Precautions
Power Sequencing
To avoid the possibility of damage to the laser module
from power supply switching transients, follow this turn-
on sequence:
1. All ground connections
2. Most negative supply
3. Most positive supply
4. All remaining connections
Reverse the order for the proper turn-off sequence.
Electrostatic Discharge
CAUTION: This device is susceptible to damage as
a result of electrostatic discharge. Take
proper precautions during both handling
and testing. Follow guidelines such as
JEDEC Publication No. 108-A (Dec.
1988).
TriQuint employs a human-body model (HBM) for ESD-
susceptibility testing and protection-design evaluation.
ESD voltage thresholds are dependent on the critical
parameters used to define the model. A standard HBM
(resistance = 1.5 k
, capacitance = 100 pF) is widely
used and can be used for comparison purposes.
Mounting Instructions
The minimum fiber bend radius is 31.25 mm (1.23 in.).
To avoid degradation in performance, mount the mod-
ule on the board as follows:
1. Place the bottom flange of the module on a flat heat
sink at least 0.5 in. x 1.180 in. (12.7 mm x 30 mm) in
size. The surface finish of the heat sink should be
better than 32 in. (0.8 m), and the surface flatness
must be better than 0.001 in. (25.4 m). Using ther-
mal conductive grease is optional; however, thermal
performance can be improved by up to 5% if conduc-
tive grease is applied between the bottom flange and
the heat sink.
2. Mount four #2-56 screws with Fillister heads
(M2-3 mm) at the four screw-hole locations (see Out-
line Diagram). The Fillister head diameter must not
exceed 0.140 in. (3.55 mm). Do not apply more than
1 in.-lb. of torque to the screws.
Note: Dimensions are in inches and (millimeters).
Figure 2. Fillister Head Screw
0.118
(3.00)
0.062 (1.58)
0.140
(3.56)
0.031 (0.79)
0.129 (3.28) R
0.086
(2.18)
0.041 (1.04)
1-532
4
For additional information and latest specifications, see our website: www.triquint.com
1.5 m D2500-Type Digital
Data Sheet, Rev. 1
Isolated DFB Laser Module
February 2003
Characteristics
Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are
the result of engineering evaluations. Typical values are for information purposes only and are not part of the test-
ing requirements.
* Standard operating condition is 5.0 V reverse bias.
Ratio of thermistor resistance at 0 C to thermistor resistance at 50 C.
* Other dispersion penalties at various dispersions available.
Table 1. Electrical Characteristics (at 25 C Laser Temperature)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Laser Forward Voltage
V
LF
L
F
= 2 mW (CW)
--
1.3
1.8
V
Laser Submount Temperature
T
LASER
--
--
25
--
C
Slope Efficiency
L
F
= 2 mW (CW)
0.025
0.10
--
mW/mA
Threshold Current
I
TH
--
--
12
50
mA
Monitor Reverse-bias Voltage*
V
RMON
--
3
5
10
V
Monitor Current
I
RMON
P
O
= 1 mW (CW)
0.1
1.0
2.0
mA
Monitor Dark Current
I
D
I
F
= 0, V
RMON
= 5 V
--
0.01
0.1
A
Input Impedance
Z
IN
--
--
25
--
Thermistor Current
I
TC
--
10
--
100
A
Resistance Ratio
--
--
9.1
9.6
10.1
--
Thermistor Resistance
R
TH
T
L
= 25 C
9.5
--
10.5
k
TEC Current
I
TEC
T
L
= 25 C, T
C
= 70 C
--
0.6
1.0
A
TEC Voltage
V
TEC
T
L
= 25 C, T
C
= 70 C
--
1.3
2.0
V
TEC Capacity
T
T
C
= 70 C
--
--
50
C
Table 2. Optical Characteristics (at 25 C Laser Temperature)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Peak Optical Output Power
P
PEAK
--
2.0
--
--
mW
Center Wavelength
C
--
1530
--
1570
nm
Line Width (3 dB full width)
Modulated at 2.5 Gb/s at
rated power
--
2
10
MHz
Side-mode Suppression Ratio
SMSR
Modulated at 2.5 Gb/s
30
--
--
dB
Optical Isolation
--
0 C to 65 C
30
--
--
dB
Wavelength Drift (EOL)
Tested over
25-year lifetime
--
--
0.1
nm
Center Wavelength Drift with
Case Temperature
c/Tc
0 C
Tc 70 C
--
--
1
pm/C
Table 3. Dispersion Performance (examples of dispersion penalty specifications)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Dispersion Penalty:*
D2502
D2511
D2517
DP
DP
DP
1350 ps/nm
1800 ps/nm
3000 ps/nm
--
--
--
--
--
--
2.0
2.0
2.0
dB
dB
dB
For additional information and latest specifications, see our website: www.triquint.com
5
Data Sheet, Rev. 1
1.5 m D2500-Type Digital
February 2003
Isolated DFB Laser Module
Outline Diagram
Dimensions are in inches and (millimeters). Tolerances are 0.005 in. (0.127 mm).
1-520.g
0.180 (4.56)
HEAT SINK
0.215 (5.45)
0.056 (1.42)
0.030 (0.75)
39.37 (1000.00)
MIN
0.10
(2.5)
0.260 (6.60)
0.215
(5.47)
REF
0.036
(0.91)
PIN 1
0.078 (1.98)
0.100 (2.54) TYP
0.105 (2.67) DIA
TYP (4) PLACES
0.020 (0.51) TYP
0.508 0.008
(12.90 0.2)
STRAIN
RELIEF
PIN 14
TRADEMARK, CODE, LASER SERIAL NUMBER,
AND DATE CODE IN APPROX. AREA SHOWN
0.200
(5.08)
~
1.025 (26.04)
0.10 0.002
(2.54 0.051)
0.213 (5.40) TYP
0.500
(12.70)
0.350
(8.89)
0.605
(15.37)
MAX
2.03 (51.6)
0.863 (21.91)
0.575 (14.61)
0.820 (20.83)
0.700 (17.78)
0.365
(9.27)
MAX
1.180 (29.97)
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