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Datasheet: M14C16DD (STMicroelectronics)

Die Description

 

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STMicroelectronics
DD.M14C16/9811V1.1
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M14C16 DD
M14C16 Die Description
PRODUCT
M14C16
s
WAFER SIZE
152 mm (6 inches)
s
DIE IDENTIFICATION M14C16KA_R
s
DIE SIZE (X x Y)
1390 x 2375 m
s
SCRIBE LINE
101.8 x 102.4 m
s
PAD OPENING
100 x 100 m
DIE LAYOUT
s
DI
Die Identification (at the position shown in Figure 1)
s
C1, C2, C3, C5, C7
Pad contacts to the ISO pins (at the positions shown in Figure 1)
s
C4, C6, C8
These ISO pins do not appear on the M14C16 die
s
NC
This pad, shown in Figure 1, is Not Connected
Pad locations are measured relative to the die centre (where X and Y are respectively the horizontal and
vertical axis, measured in m).
Figure 1. M14C16 Die Plot
AI02496
C3: SCL (X= 514.4; Y= 904.4)
C7: SDA (X= 429.0; Y= +1004.3)
DI
NC: TEST
NC: TEST
NC: TEST
C5: GND (X= +337.7; Y= +1020.6)
C2: WC
(X= 349.4; Y= 1004.4)
C1: VCC
(X= +514.3; Y= 604.0)
M14C16 DD
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to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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