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Datasheet: D22 (STMicroelectronics)

Memory Micromodules General Information for D1, D2 and C Packaging

 

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STMicroelectronics
1/13
December 1999
D10, D15, D20, D22, C20, C30
MICROMODULES
Memory Micromodules
General Information for D1, D2 and C Packaging
s
Micromodules were developed specifically for
embedding in Smartcards and Memory Cards
s
The Micromodule provides:
Support for the chip
Electrical contacts
Suitable embedding interface for gluing the
module to the plastic package
s
Physical dimensions and contact positions
compliant to the ISO 7816 standard
s
Micromodules delivered as a continuous Super
35 mm tape. (This differs from the standard
35 mm tape in the spacing distance between
the indexing holes.)
DESCRIPTION
Memory Cards consist of two main parts: the
plastic card, and the embedded Micromodule
(which, in turn, carries the silicon chip).
The plastic card is made of PVC, ABS or similar
material, and can be over-printed with graphics,
text, and magnetic strips. The Micromodule is
embedded in a cavity in the plastic card.
The Micromodules are mounted on Super 35 mm
metallized epoxy tape, and are delivered on reels.
These contain all of the chips from a number of
wafers, including those chips that were found to be
non-functioning during testing. Traceability is
ensured by a label fixed on the reel.
D10
D20
11
1
1
1
1
1
1
potting side
contact side
D15
D22
C30
C20
Table 1. Memory Card and Memory Tag Integrated Circuits
Modul e
Please see the data briefing sheets of these products for example illustrations of these
micromodules
D10
ST1200, ST1305B, ST1331, ST1333, ST1335, ST1336, ST1353, ST1355
D15
ST14C02, ST1305B, ST1335, ST1336, ST1355
D20
ST14C02, M14C04, M14C16, M14C32
D22
M14C64, M14128, M14256
C30
M35101, M35102
C20
M35101, M35102
2/13
MICROMODULES
The assembly flows is as follows:
1. Dice sawing
2. Dice attach
3. Wire bonding
4. Potting
5. Milling (depending on product)
The range of products and types of Micromodule
are summarized in Table 1 and Table 2. For large
volumes, ST is able to offer customized module
tape.
DELIVERY
The Super 35mm metallized epoxy tape is
delivered on reels, as shown in Figure 1. These
contain all of the chips from a number of wafers,
including those chips that were found to be non-
functioning during testing. Traceability is ensured
by a label fixed on the reel.
The typical quantity is 10,000 modules per reel,
with priority given to lot integrity on the reel. The
maximum quantity is 15,000 per reel.
Parts which are faulty (mechanically or electrically
defective) are identified by punch holes. The
specification for the reject punch holes is shown in
Figure 4 for the D10 micromodule, in Figure 5 for
the D15 micromodule, in Figure 6 for the D20
micromodule, and in Figure 7 for the D22
micromodule.
Tape joins (tape splicing) are never more than 10
per 10 metre length, as shown in Figure 2 and
Figure 3.
At least 2.1 m of leader, and 2.1 m of trailer is
included on each reel. Each is made of PVC Super
35 mm tape, without metalisation, and is opaque
to infrared and white light.
A "failure" marking of reject holes is included at the
beginning and end of the tape of a minimum of 5
consecutive module pitches (double positions).
Modules should be stored within the temperature
range -40
C to + 85
C, for no more than 1 year.
Each reel is packed in an antistatic bag, along with
a desiccant bag, and a humidity indicator card.
This card indicates the level of humidity as follows:
30 - Blue: protection assured
40 - Pink: renew the desiccant bag
50 - Pink: protection no longer ensured
Three self adhesive plastic identification labels are
attached: one to the reel, one to the antistatic bag,
Table 2. Memory Card Products
Type
Description (please see the indiv idual product data
sheets for full specifications)
Process
Technology
Module Style
ST14C02C
Memory Card IC, 2 Kbit (256 x 8) Serial I
2
C Bus EEPROM
1.2
m
CMOS
D15, D20
M14C04
Memory Card IC, 4 Kbit Serial I
2
C Bus EEPROM
0.6
m
CMOS
D20
M14C16
Memory Card IC, 16 Kbit Serial I
2
C Bus EEPROM
0.6
m
CMOS
D20
M14C32
Memory Card IC, 32 Kbit Serial I
2
C Bus EEPROM
0.6
m
CMOS
D20
M14C64
Memory Card IC, 64 Kbit Serial I
2
C Bus EEPROM
0.6
m
CMOS
D22
M14128
Memory Card IC, 128 Kbit Serial I
2
C Bus EEPROM
0.6
m
CMOS
D22
M14256
Memory Card IC, 256 Kbit Serial I
2
C Bus EEPROM
0.6
m
CMOS
D22
ST1200
Memory Card IC, 256 bit OTP EPROM with Lock-Out
3.5
m
NMOS
D10
ST1305B
Memory Card IC, 192 bit High Endurance EEPROM
with Secure Logic Access Control
1.5
m
CMOS
D10, D15
ST1331
Memory Card IC, 272 bit High Endurance EEPROM
with Advanced Security Mechanisms
1.2
m
CMOS
D10
ST1333
1.2
m
CMOS
D10
ST1335
1.2
m
CMOS
D10, D15
ST1336
1.2
m
CMOS
D10, D15
M35101
Contactless Memory Chip, 13.56 MHz, 2048 bit EEPROM
0.6
m
CMOS
C20, C30
M35102
Contactless Memory Chip with 64-bit Unique ID,
13.56 MHz, 2048 bit EEPROM
0.6
m
CMOS
C20, C30
MICROMODULES
3/13
Table 3. Manufacturing Flow and Manufacturing Facility Locations
Table 4. Material Specification
Operation
Location and Facility
Wafer Diffusion
Rousset, France. 6" wafer fab.
Agrate, Italy. 6" wafer fab.: standard EEPROM only
Electrical Wafer Test
Rousset, France.
Agrate, Italy: standard EEPROM only
Assembly
Casablanca, Morocco.
Final Test
Rousset, France.
Casablanca, Morocco.
Material
Description
Tape
Basic material
MCTS T2 or IBIDEN rough, typical thickness 120
m
Adhesive
Modified epoxy, typical thickness 18
m
Laminated copper foil
Typical thickness 35
m
Adhesive strength
> 0.8 N/mm at room temperature. Monitored by the tape manufacturer using
appropriate test methods
Tape Surface
The whole epoxy adhesive surface is controlled to be free of dirt, grease, cleaning
compounds and parting compounds
Surface roughness
Typically Rz: 3-12
m at first accepted delivery
Contact surface
Nickel-gold, galvanised treatment
Nickel thickness
2
m (min.)
Gold thickness
contact side, 0.1
m (min.)
Total tape thickness
160
30
m
Control, Palmer
"Special flat" diameter 3 mm, F = 1.5 N
Chip Interconnect
Dice bonding
Silver epoxy
Bonding wire
Gold 25
m
Ring (D22 only)
Bronze
Protective coating
Material
UV epoxy, Black epoxy
Assembly
Casablanca, Morocco.
4/13
MICROMODULES
Table 5. Size of the Reel Box
Table 6. AQL Levels
Manufacturing Location
Size of Reel Box
Rousset
370 x 390 x 80 mm
Casablanca
373 x 370 x 78 mm
Defect
AQL
Total defects - mechanical and electrical
0.65
Mechanical defects
0.65
Electrical defects
0.65
Table 7. Visual and Mechanical Specification and Test Conditions
Note: 1. Test 3 and 4 are conducted in accordance with MIL-STD-833.
Test
Description and Method
Reject Criteria
1
Contact area
Glue or particles, scratches print, sever defects on contact area
damaging the gold layer. Visual test distance 30 cm, naked eye.
2
Chip covering
Thickness and external dimension measurement exceeding total
thickness, or other dimensions not complying to the drawings
3
1
Die bond strength
Die shear force < 10 N
4
1
Wire bonding
Wire lift or broken at pull test with < 4 g
Any observed discrepancies should be reported in
writing to the ST quality department. Table 6
shows the recommended AQL levels.
The visual and mechanical test specification and
test conditions are described in Table 7.
Defect Acceptance Rate
Each reel contains the stated number of defective
devices, distributed so that no more than 20% of
them are found in a contiguous block on the tape.
ST's own quality acceptance standard guarantees
that the customer will be informed when the
electrical yield is less than 90%.
The part numbers and re-ordering information will
be set according to ST's current product coding
policy, as shown on the individual product data
sheets, or as agreed with the customer.
Reels that do not pass inspection should be
returned to ST within 15 working days after
delivery.
and one to the reel box. Each label carries the
following information:
PRODUCT:
sales type
LOT NUMBER: reel number
POS:
total number of positions
GOOD:
number of good positions
FAIL:
number of fail positions
DATE:
date of sealing
In addition, the antistatic bag and the delivery box
carry a self adhesive plastic "ESD" warning label,
85 x 38 mm
in
size,
indicating
"Electrostatic
sensitive devices".
Each reel is packed in a reel box, made of recycled
cardboard. The size of the reel box depends on its
origin. Several reel boxes are packed in a delivery
box, which is also made of recycled cardboard.
A delivery note is provided, listing the following
information:
Date of sealing
Reel numbers
Total number of positions, with the details of
positions per reel
Order number and customer name
Sales type
Tape type
RECOMMENDED ACCEPTANCE CRITERIA
The product identity should be checked against
the delivery documentation, and the quantity of
good positions on the reel recorded. The product
may be tested in accordance with the appropriate
data sheet, the conditions depending on the
product type, and the ISSUER or USER mode (for
ST13xx products).
For
delivery
acceptance,
ST
recommends
sampling the Micromodules from the beginning of
the reel. The sampling AQL should be applied, to
the ISO 2859 standard (test level II, normal test).
MICROMODULES
5/13
RELIABILITY
Product
qualification
and
on-going
reliability
monitoring is performed by ST. The principal steps
are listed in Table 8 and Table 9.
Table 8. Package Related Tests
Note: 1. The notation
m/n means: reject the whole lot if more than m devices fail from a sample of n devices. For instance, 0/45 means a
sample of 45 devices taken from a lot, with the whole lot only accepted if every one of the 45 sample devices passed the test.
Table 9. Product Related Tests
Test
Description
Method
Condit ion
LPTD
Criteria
(note 1)
1
Geometry
ST Specification
Monitoring/Lot
5
0/45
2
Visual inspection
ST Specification
Outgoing/Lot
AQL= 0.040
0/315
3
Temperature cycling
MIL-STD-883
Method 1010
-40
C to 150
C, 100 cycles
5
0/45
4
Salt atmosphere
corrosion of contacts
MIL-STD-883
Method 1009
35
C, 5% NaCl, 24 hour
15
0/15
5
Moisture resistance
MIL-STD-883
Method 1004
85
C, 85% HR Biased 5.5 V,
168 hour
7
0/32
6
Vibration with electrical
measurement
ISO/IEC 10373
1 octave/minute, acceleration up to
10 G (repeated 20 times)
measurement memory check at 25
C
20
0/11
7
Bending properties
ISO/IEC 7816-1
Long side: deflection 2 cm
Short side: deflection 1 cm
30 bendings per minute
20
0/11
8
Torsion properties
ISO/IEC 7816-1
Maximum displacement 15
1
1000 torsions, 30 torsions per minute
applied on long side only
20
0/11
Test
Description
Method
Condit ion
LPTD
Criteria
1
Life test
MIL-STD-883
Method 1005
140
C, 6 V, 504 hours measurement
memory check at 25
C
3
0/76
2
Electrostatic discharge
MIL-STD-883
Method 3015
Human body model:
1.5 k
, 100 pF,
5000 V
n/a
0/9
Electrostatic discharge
MIL-STD-883
Method 3015
Machine model: 0
, 200 pF,
200 V
measurement memory check at 25
C
n/a
0/9
3
Data retention,
Temperature storage
MIL-STD-883
Method 1005
150
C, 1000 hours, no bias
measurement memory check at 25
C
5
0/45
4
Write/Erase cycles
ST Specification
100,000 Cycles
200 ppm/
1024 byte/
1000 cycle
0/32
5
Magnetic field, memory
check
ISO IEC 10373
79,500 A/m
15
1/25
6
X-rays, memory check
ISO IEC 10373
70 kV, 0.1 Grey
15
1/25
7
UV light, memory check
ISO IEC 10373
15 W.s/cm
2
, 30 minutes maximum
15
1/25
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