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Datasheet: P0402FC05C (Protek Devices)

Flip Chip Array

 

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Protek Devices
P0402FC3.3C*
thru
P0402FC36C*
1
05107.R9 4/05
www.protekdevices.com
FLIP CHIP ARRAY
Only One Name Means ProTek'TionTM
*U.S. Patent No. Des. "D456,367S"
APPLICATIONS
Cellular Phones
MCM Boards
Wireless Communication Circuits
IR LEDs
SMART & PCMCIA Cards
IEC COMPATIBILITY (EN61000-4)
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
61000-4-4 (EFT): 40A - 5/50ns
FEATURES
ESD Protection > 25 kilovolts
Available in Multiple Voltage Types Ranging From 3.3V to 36V
250 Watts Peak Pulse Power per Line (tp = 8/20s)
Bidirectional Configuration & Monolithic Structure
Protects 1 Line
RoHS Compliant in Lead-Free Versions
MECHANICAL CHARACTERISTICS
Standard EIA Chip Size: 0402
Weight 0.73 milligrams (Approximate)
Available in Tin-Lead or Lead-Free Plating
Solder Reflow Temperature:
Tin-Lead - Sn/Pb, 85/15: 240-245C
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270C
Flammability Rating UL 94V-0
8mm Plastic & Paper Tape and Reel Per EIA Standard 481
Device Marking On Reel
Top Contacts: Solder Bump 0.004" in Height (Nominal)
0402
05107
PIN CONFIGURATION
2
www.protekdevices.com
05107.R9 4/05
P0402FC3.3C*
thru
P0402FC36C*
*U.S. Patent No. Des. "D456,367S"
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25C Unless Otherwise Specified
Operating Temperature
SYMBOL
VALUE
-55
C to 150
C
C
C
-55
C to 150
C
UNITS
T
J
T
STG
PARAMETER
Storage Temperature
Peak Pulse Power (t
p
= 8/20s) - See Figure 1
P
PP
250
Watts
0 5 10 15 20 25 30
t - Time - s
0
20
40
60
80
100
120
I
PP
- Peak Pulse Current - % of I
PP
TEST
WAVEFORM
PARAMETERS
t
f
= 8s
t
d
= 20s
t
f
Peak Value I
PP
e
-t
t
d
= t
I
PP
/2
FIGURE 2
PULSE WAVE FORM
0.01 1 10 100 1,000 10,000
t
d
- Pulse Duration - s
10
100
1,000
10,000
P
PP
- Peak Pulse Current - Watts
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
250W, 8/20s Waveform
ELECTRICAL CHARACTERISTICS PER LINE @ 25C Unless Otherwise Specified
PART
NUMBER
(See Note 1)
MINIMUM
BREAKDOWN
VOLTAGE
@ 1mA
V
(BR)
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ I
P
= 1A
V
C
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@8/20s
V
C
@ I
PP
TYPICAL
CAPACITANCE
@0V, 1 MHz
C
pF
P0402FC3.3C
P0402FC05C
P0402FC08C
P0402FC12C
P0402FC15C
P0402FC24C
P0402FC36C
3.3
5.0
8.0
12.0
15.0
24.0
36.0
4.0
6.0
8.5
13.3
16.7
26.7
40.0
7.0
9.8
13.4
19.0
24.0
43.0
64.0
12.5V @ 20A
14.7V @ 17A
19.2V @ 13A
29.7V @ 9.0A
35.7V @ 7.0A
55.0V @ 5.0A
84.0V @ 3.0A
150
100
75
50
40
30
25
MAXIMUM
LEAKAGE
CURRENT
(See Note 2)
@V
WM
I
D
A
75*
10**
10***
1
1
1
1
RATED
STAND-OFF
VOLTAGE
V
WM
VOLTS
Note 1:
All devices are bidirectional. Electrical characteristics apply in both directions.
Note 2:
*Maximum leakage current < 5A @ 2.8V. **Maximum leakage current <500nA @ 3.3V. ***Maximum leakage current <200nA @ 5V.
3
www.protekdevices.com
05107.R9 4/05
P0402FC3.3C*
thru
P0402FC24C*
*U.S. Patent No. Des. "D456,367S"
GRAPHS
0 5 10 15 20
V
C
- Clamping
V
oltage -
V
olts
0
4
8
12
14
FIGURE 5
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR P0402FC05C
10
6
2
I
PP
- Peak Pulse Current - Amps
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR P0402FC05C
5
V
o
lts per Division
-5
5
15
25
35
0 25 50 75 100 125 150
T
L
- Lead Temperature - C
20
40
60
80
100
% Of Rated Power
Peak Pulse Power
8/20s
Average Power
FIGURE 3
POWER DERATING CURVE
0
4
www.protekdevices.com
05107.R9 4/05
P0402FC3.3C*
thru
P0402FC36C*
*U.S. Patent No. Des. "D456,367S"
APPLICATION INFORMATION
Ramp-up
Ramp-down
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
T
S
- Preheat
T
SMAX
T
SMIN
T
L
t 25C to Peak
30-60 seconds
T
emperature - C
T
P
155
140
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
50m
20m
60 Seconds
270C
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183C)
Soldering Maximum Temperature
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
REQUIREMENTS
Temperature:
T
P
for Lead-Free (SnAgCu): 260-265C
T
P
for Tin-Lead: 240-245C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
5
www.protekdevices.com
05107.R9 4/05
P0402FC3.3C*
thru
P0402FC24C*
*U.S. Patent No. Des. "D456,367S"
PACKAGE OUTLINE & DIMENSIONS
COPYRIGHT ProTek Devices 2005
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer's and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail:
sales@protekdevices.com
Web Site:
www.protekdevices.com
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance with EIA 481.
2.
8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., P0402FC05C-T75-1).
3.
8mm Paper Tape: 7 Inch Reels -10,000 pieces per reel. Ordering Suffix: -T710-2 (i.e., P0402FC05C-T710-2).
4. Suffix - LF = Lead-Free, i.e.,
P0402FC05C-LF-T75-1.
A
B
C
D
E
F
G
H
I
0.46 NOM
0.86 NOM
0.99 0.0254
0.10 NOM
0.35 NOM
0.483 0.0254
0.20 NOM
0.127 MAX
0.076 MIN
0.406 NOM
0.018 NOM
0.034 NOM
0.039 0.001
0.004 NOM
0.014 NOM
0.019 0.001
0.008 NOM
0.005 MAX
0.003 MIN
0.016 NOM
DIM
MILLIMETERS
INCHES
PACKAGE DIMENSIONS
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and outline:
.xxx 0.05mm ( 0.002").
3. Maximum chip size: 1.02 (0.040") by 0.51(0.020").
PACKAGE OUTLINE
0402
MOUNTING PAD
NOTE:
1.
Preferred: Using 0.1mm (0.004") stencil.
A
B
C
D
E
F
G
H
I
0.23
0.48
0.69
0.46
0.99
0.20
0.20
0.66
0.13
0.009
0.019
0.027
0.018
0.039
0.008
0.008
0.026
0.005
DIM
MILLIMETERS
INCHES
PAD DIMENSIONS
NOTE:
1. Top view of tape. Metal contacts are face down in tape
package.
TAPE & REEL ORIENTATION
Single Die - 0402
Outline & Dimensions: Rev 3 - 11/02, 06001
G
D
H
E
F
I
SIDE
A
B
C
TOP
END
B
C
SOLDER
BUMP
A
H
D
I
SOLDER PRINT
DIAMETER 0.010" -
0.012"
F
G
DIE
E
SOLDER P
A
D
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