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Datasheet: M1MA141KT1 (Motorola, Inc.)

Sc-70/sot-323 Package Single Silicon Switching Diode 40/80 V-100 Ma Surface Mount

 

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Motorola, Inc.
1
Motorola Small­Signal Transistors, FETs and Diodes Device Data
Single Silicon Switching Diode
This Silicon Epitaxial Planar Diode is designed for use in ultra high speed switching
applications. This device is housed in the SC­70 package which is designed for low
power surface mount applications.
·
Fast trr, < 3.0 ns
·
Low CD, < 2.0 pF
·
Available in 8 mm Tape and Reel
Use M1MA141/2KT1 to order the 7 inch/3000 unit reel.
Use M1MA141/2KT3 to order the 13 inch/10,000 unit reel.
MAXIMUM RATINGS
(TA = 25
°
C)
Rating
Symbol
Value
Unit
Reverse Voltage
M1MA141KT1
VR
40
Vdc
M1MA142KT1
80
Peak Reverse Voltage
M1MA141KT1
VRM
40
Vdc
M1MA142KT1
80
Forward Current
IF
100
mAdc
Peak Forward Current
IFM
225
mAdc
Peak Forward Surge Current
IFSM(1)
500
mAdc
THERMAL CHARACTERISTICS
Rating
Symbol
Max
Unit
Power Dissipation
PD
150
mW
Junction Temperature
TJ
150
°
C
Storage Temperature
Tstg
­ 55 ~ + 150
°
C
ELECTRICAL CHARACTERISTICS
(TA = 25
°
C)
Characteristic
Symbol
Condition
Min
Max
Unit
Reverse Voltage Leakage Current
M1MA141KT1
IR
VR = 35 V
--
0.1
µ
Adc
M1MA142KT1
VR = 75 V
--
0.1
Forward Voltage
VF
IF = 100 mA
--
1.2
Vdc
Reverse Breakdown Voltage
M1MA141KT1
VR
IR = 100
µ
A
40
--
Vdc
M1MA142KT1
80
--
Diode Capacitance
CD
VR = 0, f = 1.0 MHz
--
2.0
pF
Reverse Recovery Time
trr(2)
IF = 10 mA, VR = 6.0 V,
RL = 100
, Irr = 0.1 IR
--
3.0
ns
1. t = 1 SEC
2. trr Test Circuit
Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value.
Order this document
by M1MA141KT1/D
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
M1MA141KT1
M1MA142KT1
SC­70/SOT­323 PACKAGE
SINGLE SILICON
SWITCHING DIODE
40/80 V­100 mA
SURFACE MOUNT
CASE 419­02, STYLE 2
SC­70/SOT­323
Motorola Preferred Devices
1
2
3
©
Motorola, Inc. 1996
CATHODE
3
ANODE
1
NO CONNECTION
2
REV 2
M1MA141KT1 M1MA142KT1
2
Motorola Small­Signal Transistors, FETs and Diodes Device Data
A
RL
tr
tp
t
10%
90%
VR
tp = 2
µ
s
tr = 0.35 ns
IF
trr
t
Irr = 0.1 IR
IF = 10 mA
VR = 6 V
RL = 100
RECOVERY TIME EQUIVALENT TEST CIRCUIT
INPUT PULSE
OUTPUT PULSE
MH
X
Marking Symbol
Type No.
141K
142K
Symbol
MH
MI
DEVICE MARKING -- EXAMPLE
The "X" represents a smaller alpha digit Date Code. The Date Code
indicates the actual month in which the part was manufactured.
100
0.2
0.4
VF, FORWARD VOLTAGE (VOLTS)
0.6
0.8
1.0
1.2
10
1.0
0.1
TA = 85
°
C
10
0
VR, REVERSE VOLTAGE (VOLTS)
1.0
0.1
0.01
0.001
10
20
30
40
50
0.68
0
VR, REVERSE VOLTAGE (VOLTS)
0.64
0.6
0.56
0.52
C
D
, DIODE CAP
ACIT
ANCE
(pF)
2
4
6
8
I F
, FOR
W
ARD
CURRENT

(mA)
Figure 1. Forward Voltage
Figure 2. Reverse Current
Figure 3. Diode Capacitance
TA = ­ 40
°
C
TA = 25
°
C
TA = 150
°
C
TA = 125
°
C
TA = 85
°
C
TA = 55
°
C
TA = 25
°
C
I R
, REVERSE CURRENT

(
µ
A)
M1MA141KT1 M1MA142KT1
3
Motorola Small­Signal Transistors, FETs and Diodes Device Data
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
mm
inches
0.035
0.9
0.075
0.7
1.9
0.028
0.65
0.025
0.65
0.025
SC­70/SOT­323 POWER DISSIPATION
The power dissipation of the SC­70/SOT­323 is a function
of the collector pad size. This can vary from the minimum
pad size for soldering to the pad size given for maximum
power dissipation. Power dissipation for a surface mount
device is determined by TJ(max), the maximum rated junction
temperature of the die, R
JA, the thermal resistance from the
device junction to ambient; and the operating temperature,
TA. Using the values provided on the data sheet, PD can be
calculated as follows.
PD =
TJ(max) ­ TA
R
JA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature TA of 25
°
C, one can
calculate the power dissipation of the device which in this
case is 150 milliwatts.
PD =
150
°
C ­ 25
°
C
833
°
C/W
= 150 milliwatts
The 833
°
C/W assumes the use of the recommended
footprint on a glass epoxy printed circuit board to achieve a
power dissipation of 150 milliwatts. Another alternative would
be to use a ceramic substrate or an aluminum core board
such as Thermal Clad
TM
. Using a board material such as
Thermal Clad, a power dissipation of 300 milliwatts can be
achieved using the same footprint.
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
·
Always preheat the device.
·
The delta temperature between the preheat and
soldering should be 100
°
C or less.*
·
When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference should be a maximum of 10
°
C.
·
The soldering temperature and time should not exceed
260
°
C for more than 10 seconds.
·
When shifting from preheating to soldering, the
maximum temperature gradient should be 5
°
C or less.
·
After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
·
Mechanical stress or shock should not be applied during
cooling
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
M1MA141KT1 M1MA142KT1
4
Motorola Small­Signal Transistors, FETs and Diodes Device Data
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of control
settings that will give the desired heat pattern. The operator
must set temperatures for several heating zones, and a
figure for belt speed. Taken together, these control settings
make up a heating "profile" for that particular circuit board.
On machines controlled by a computer, the computer
remembers these profiles from one operating session to the
next. Figure 4 shows a typical heating profile for use when
soldering a surface mount device to a printed circuit board.
This profile will vary among soldering systems but it is a good
starting point. Factors that can affect the profile include the
type of soldering system in use, density and types of
components on the board, type of solder used, and the type
of board or substrate material being used. This profile shows
temperature versus time. The line on the graph shows the
actual temperature that might be experienced on the surface
of a test board at or near a central solder joint. The two
profiles are based on a high density and a low density board.
The Vitronics SMD310 convection/infrared reflow soldering
system was used to generate this profile. The type of solder
used was 62/36/2 Tin Lead Silver with a melting point
between 177 ­189
°
C. When this type of furnace is used for
solder reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
STEP 1
PREHEAT
ZONE 1
"RAMP"
STEP 2
VENT
"SOAK"
STEP 3
HEATING
ZONES 2 & 5
"RAMP"
STEP 4
HEATING
ZONES 3 & 6
"SOAK"
STEP 5
HEATING
ZONES 4 & 7
"SPIKE"
STEP 6
VENT
STEP 7
COOLING
200
°
C
150
°
C
100
°
C
50
°
C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
205
°
TO 219
°
C
PEAK AT
SOLDER JOINT
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
100
°
C
150
°
C
160
°
C
140
°
C
Figure 4. Typical Solder Heating Profile
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
170
°
C
M1MA141KT1 M1MA142KT1
5
Motorola Small­Signal Transistors, FETs and Diodes Device Data
PACKAGE DIMENSIONS
CASE 419-02
ISSUE H
SC­70/SOT­323
STYLE 2:
PIN 1. ANODE
2. N.C.
3. CATHODE
C
R
N
A
L
D
G
V
S
B
H
J
K
3
1
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.071
0.087
1.80
2.20
B
0.045
0.053
1.15
1.35
C
0.035
0.049
0.90
1.25
D
0.012
0.016
0.30
0.40
G
0.047
0.055
1.20
1.40
H
0.000
0.004
0.00
0.10
J
0.004
0.010
0.10
0.25
K
0.017 REF
0.425 REF
L
0.026 BSC
0.650 BSC
N
0.028 REF
0.700 REF
R
0.031
0.039
0.80
1.00
S
0.079
0.087
2.00
2.20
V
0.012
0.016
0.30
0.40
0.05 (0.002)
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