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Datasheet: M1T2HT25FL64 (MoSys)

Standard 1T-SRAM Macros

 

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High Speed Flow-through 2-Mbit (32Kx64)
Standard 1T-SRAM
Embedded Memory Macro
M1T2HT25FL64
M1T2HT25FL64 Rev1_02
Page 1
2001 MoSys Inc., All Rights Reserved, 1020 Stewart Drive, Sunnyvale, CA 94085
High Speed 1T-SRAM Standard Macro
83 MHz operation
1-Clock cycle time
Flow-through read access timing
Late write mode timing
64-Bit wide data buses
Simple standard SRAM interface
Fast
delivery
Ultra-Dense Memory
7.25mm
2
size per macro instance
Redundancy & fuses included in macro area
Silicon-Proven 1T-SRAM Technology
Qualification programs completed
Products in volume production
High Yield and Reliability
Built-in redundancy for enhanced yield
Standard Logic Process
TSMC 0.25m CL025G process
Logic design rules
Uses 4 metal layers
Routing over macro possible in layers 5+
Power
Single voltage 2.5V Supply
Low power consumption

General Description
The M1T2HT25FL64 is a 2Mbit (2,169,152 bits), high speed, embedded 1T-SRAM macro. The
M1T2HT25FL64 is organized as 32K(32,768) words of 64 bits. The macro employs a flow-through read timing
interface with late write timing. The M1T2HT25FL64 macro is implemented using MoSys 1T-SRAM technology,
resulting in extremely high density and performance.
High Speed Flow-through 2-Mbit (32Kx64)
Standard 1T-SRAM
Embedded Memory Macro
M1T2HT25FL64
M1T2HT25FL64 Rev1_02
Page 2
2001 MoSys Inc., All Rights Reserved, 1020 Stewart Drive, Sunnyvale, CA 94085
Memory Interface Signal List
Signal Name
Valid
Logic Direction
Description
adr[14:0]
Positive clk edge
Positive
Input
Memory address
rdb
Positive clk edge
Negative
Input
Memory read
wrb
Positive clk edge
Negative
Input
Memory write
din[63:0]
Positive clk edge
Positive
Input
Memory data in bus
dout[63:0]
Positive clk edge
Positive
Output
Memory data out bus
Rstb
Positive clk edge
Negative
Input
Memory initialization reset
Clk Clock
Positive
Input
Memory
Clock
mvddcore
Memory core supply voltage
mvsscore
Memory core ground
Mvdd
Memory interface supply voltage
Mvss
Memory interface ground
Recommended Operating Conditions
Symbol Parameter Condition
Min
Max
Units
VDD
Supply Voltage Range (2.5V
10%)
Operating 2.25
2.75 V
TJ
Junction Temperature
Nominal VDD 0
125 C
tCYC Cycle
Time
Operating
12
33.3*
ns
tCKH Clock
High
Operating
0.45*tCYC 0.55*tCYC
ns
tCKL Clock
Low
Operating
0.45*tCYC 0.55*tCYC
ns
*Note: Minimum clock frequency limit adjustable to meet system timing requirements
Power Requirements
Symbol Condition Current
per Instance
Units
IDD1
Operating current, V
DD
=1.8V, clock frequency = 83MHz,
output not loaded, memory accessed every clock
1.0 mA/MHz
IDD2
Standby current, V
DD
=1.8V, clock frequency =83MHz,
memory not accessed
0.5 mA/MHz
Input Loading
Symbol
Condition
Load Capacitance
Units
CDIN
din signal input loading
0.1
pF
CADR
adr signal input loading
0.1
pF
CCTL
rdb, wrb and bweb signal input loading
0.1
pF
CCLK
clk signal input loading
1.5
pF
High Speed Flow-through 2-Mbit (32Kx64)
Standard 1T-SRAM
Embedded Memory Macro
M1T2HT25FL64
M1T2HT25FL64 Rev1_02
Page 3
2001 MoSys Inc., All Rights Reserved, 1020 Stewart Drive, Sunnyvale, CA 94085
AC Timing Characteristics at Recommended Operating Conditions
All times in nanoseconds
Bolded numbers reflect worst case design parameters
Parameter
Description
Condition
Slow
Typical
Fast
tAS
Address Setup
Min.
1.5
1.2 0.9
tAH Address
Hold
Min. 0.5
0.4
0.3
tCS Control
Setup
Min. 1.5
1.2 0.9
tCH Control
Hold
Min. 0.5
0.4
0.3
tDS
Write Data Setup
Min.
1.5
1.2 0.9
tDH
Write Data Hold
Min.
0.5
0.4
0.3
tKQ
Clock to Data Valid
Max.
3.5
2.5
2.0
tKQE
Data valid extrinsic delay per pF
Max.
1.2
1.0
0.8
tKQX
Clock to Data not valid
Min.
0.8
0.6
0.4
































General AC Timing
clk
adr
bweb
dout
tCYC
tCKL tCKH
A
WR/RD
wD
tKQ
tAS
tAH
tDH
tDS
control
tCS
tCH
din
rD
tKQX
High Speed Flow-through 2-Mbit (32Kx64)
Standard 1T-SRAM
Embedded Memory Macro
M1T2HT25FL64
M1T2HT25FL64 Rev1_02
Page 4
2001 MoSys Inc., All Rights Reserved, 1020 Stewart Drive, Sunnyvale, CA 94085

Memory macro implements a synchronous reset to force state machines into a known state after power-up.
This reset does not clear the memory contents. The clock must be running for at least two cycles before the
Reset (rstb) signal will be correctly sampled as shown above. The Reset (rstb) signal must be active for at
least ten (10) clock periods to initialize all internal circuitry. Independent of the Reset (rstb) signal, after power
has stabilized to a voltage within the operating specification and the clock is operating within its timing
specifications, there must be at least 128 clock cycles before any read or write access.

clk
rdb or wrb
rstb
>10 clk
>128 clk


Initialization Timing

High Speed Flow-through 2-Mbit (32Kx64)
Standard 1T-SRAM
Embedded Memory Macro
M1T2HT25FL64
M1T2HT25FL64 Rev1_02
Page 5
2001 MoSys Inc., All Rights Reserved, 1020 Stewart Drive, Sunnyvale, CA 94085

O
PERATION
T
RUTH
T
ABLE
rdb wrb
Operation
0 0
Illegal
0 1
Read
1 0
Write
1 1
Nop
F
UNCTIONAL
O
PERATION

Address and command clocked in by rising clock edge
.
Data transfer occurs in the same clock cycle
.










Single Read Cycle Timing
Single Write Cycle Timing
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