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Datasheet: US5881UA (Melexis, Inc.)

CMOS Multi-purpose Switch

 

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3901005881
Page 1
Aug/02
Rev. 005
Features and Benefits
s
Chopper stabilized amplifier stage
s
New miniature package / thin, high reliability package
s
Operation down to 3.5V
s
CMOS for optimum stability, quality and cost
Applications
s
Solid state switch
s
Limit switch
s
Current limit
s
Interrupter
s
Current sensing
Ordering Information
Part No.
Temperature Suffix
Package Code
US5881
E (-40
o
C to 85
o
C)
SO (SOT-23)
US5881
E (-40
o
C to 85
o
C)
UA (TO-92 flat)
US5881
L (-40
o
C to 150
o
C )
SO (SOT-23)
US5881
L (-40
o
C to 150
o
C )
UA (TO-92 flat)
*Contact factory or sales representative for legacy temperature options
Description

The US5881 is a unipolar Hall effect sensor IC
fabricated from mixed signal CMOS technology. It
incorporates
advanced
chopper
stabilization
techniques to provide accurate and stable magnetic
switch points. There are many applications for this
sensor in addition to those listed above. The
design, specifications and performance have been
optimized for applications of solid state switches.

The output transistor will be switched on (B
OP
) in
the presence of a sufficiently strong South pole
magnetic field facing the marked side of the
package. Similarly, the output will be switched off
(B
RP
) in the presence of a weaker South field and
remain off with "0" field.

The SOT-23 device is reversed from the UA
package. The SOT-23 output transistor will be
switched on (B
OP
) in the presence of a sufficiently
strong North pole magnetic field subjected to the
marked face.
Functional Diagram
Note: This is a static-sensitive device; please observe ESD
precautions. Reverse V
DD
protection is not included. For reverse
voltage protection, a 100W resistor in series with V
DD
is
recommended.
Output
GND
V
DD
Voltage
Regulator
Chopper
SO Package
Pin 1 - V
DD
Pin 2 - Output
Pin 3 - GND
UA Package
Pin 1 - V
DD
Pin 2 - GND
Pin 3 - Output
3901005881
Page 2
Aug/02
Rev. 005
US5881 Electrical Specifications
DC operating parameters: T
A
= 25
o
C, V
DD
= 12V
DC
(unless otherwise specified).
Parameter
Symbol Test Conditions
Min
Typ
Max
Units
Supply Voltage
V
DD
Operating
3.5
24
V
Supply Current
I
DD
B<B
RP
1.5
2.5
5.0
mA
Saturation Voltage
V
DS(on)
I
OUT
= 20 mA, B>B
OP
0.4
0.5
V
Output Leakage
I
OFF
B<B
RP
, V
OUT
= 20V
0.01
10.0
A
Output Rise Time
t
r
V
DD
= 12V, R
L
= 1.1K
, C
L
= 20pf
0.04
s
Output Fall Time
t
f
V
DD
= 12V, R
L
= 1.1K
, C
L
= 20pf
0.18
s
US5881 Magnetic Specifications
Parameter
Symbol Test Conditions
Min
Typ
Max
Units
Operating Point
3
B
OP
15
25
30
mT
Release Point
B
RP
9.5
20
-
mT
Hysteresis
B
hys
2.0
4.3
5.5
mT
Notes:
1. 1 mT = 10 Gauss.
2. The SOT-23 device is reversed from the UA package. The SOT-23 output transistor will be switched
on (BOP) in the presence of a sufficiently strong North pole magnetic field subjected to the
markedface.
Absolute Maximum Ratings
Supply Voltage (Operating), V
DD
24V
Supply Current (Fault), I
DD
50mA
Output Voltage, V
OUT
24V
Output Current (Fault), I
OUT
50mA
Power Dissipation, P
D
100mW
Operating Temperature Range, T
A
-40C to 150C
Storage Temperature Range, T
S
-65C to 150C
Maximum Junction Temp, T
J
175C
3901005881
Page 3
Aug/02
Rev. 005
Performance Graphs
30
O
u
t
p
u
t

V
o
l
t
a
g
e

(
V
)
Flux Density (mT)
Output Voltage
versus
Flux Density
5881
10
6
12
18
24
0
-10
-20
20
30
40
0
V
DD
V
out
B
OP
B
RP
Output Voltage versus Flux Density
Typical Magnetic Switch Points
vs. Vdd
0.0
5.0
10.0
15.0
20.0
25.0
30.0
35.0
0
10
20
30
Vdd (V)
F
i
e
l
d

S
t
r
e
n
g
t
h

(
m
T
)
5881
Typical Magnetic Switch Points
vs. Temperature
0.0
5.0
10.0
15.0
20.0
25.0
30.0
35.0
-50
0
50
100
150
200
Temperature C
F
i
e
l
d

S
t
r
e
n
g
t
h

(
m
T
)
5881
Minimum & Maximum Magnetic
Switch Points
vs. Temperature
0.0
5.0
10.0
15.0
20.0
25.0
30.0
35.0
-50.0
50.0
150.0
Tem perature C
F
i
e
l
d

S
t
r
e
n
g
t
h

(
m
T
)
5881
3901005881
Page 4
Aug/02
Rev. 005
Performance Graphs
280
S
o
l
d
e
r

T
e
m
p
e
r
a
t
u
r
e

(
o
C
)
Time in Wave Solder (Seconds)
Wave Soldering Parameters
All Devices
15
200
220
240
260
10
5
0
20
25
30
500
0
P
a
c
k
a
g
e

P
o
w
e
r

D
i
s
s
i
p
a
t
i
o
n

(
m
W
)
Temperature (
o
C)
Power Dissipation
versus
Temperature
All Devices
80
100
200
300
400
0
-40
120
160
200
40
SO Package
R
JA
=575
o
C/W
UA Package
R
JA
=206
o
C/W
5
0
S
u
p
p
l
y

C
u
r
r
e
n
t


(
m
A
)
Supply Voltage (V)
Typical Supply Current
versus
Supply Voltage
5881
15
1
2
3
4
10
5
0
20
25
30
T
A
= -40
o
C
T
A
= 25
o
C
T
A
= 125
o
C
500
0
V
D
S
(
O
N
)

(
m
V
)
Temperature (
o
C)
Typical Saturation Voltage
versus
Temperature
V
DD
= 12 V, I
OUT
= 20mA
5881
80
100
200
300
400
0
-40
120
160
200
40
V
DS(ON)
3901005881
Page 5
Aug/02
Rev. 005
Unique Features
CMOS Hall IC Technology
The chopper stabilized amplifier uses switched
capacitor techniques to eliminate the amplifier
offset voltage, which, in bipolar devices, is a
major source of temperature sensitive drift.
CMOS makes this advanced technique possible.

The CMOS chip is also much smaller than a
bipolar chip, allowing very sophisticated circuitry
to be placed in less space. The small chip size
also contributes to lower physical stress and less
power consumption.
Installation
Consider temperature coefficients of Hall IC and
magnetics, as well as air gap life time variations.
Observe
temperature
limits
during
wave
soldering.
Application Comments
If reverse supply protection is desired, use a
resistor in series with the V
DD
pin. The resistor
will limit the supply current (Fault), I
DD
, to 50 mA.
For severe EMC conditions, use the application
circuit below.


Applications Examples
Two Wire Optional Current
Biasing Circuit
R
L
R
b
Hall
IC
Iout
I
D
D
V
DD
The resistors R
b
and R
L
can be used to bias the input current, I
IN
. Refer to
the part specification for limiting values. This circuit will help in getting the
precise ON and OFF currents desired.
B
RP
= Ioff = (V
DD
/ Rb + I
DD
)
B
OP
= Ion = (Ioff + V
DD
/ R
L
)
I
IN
Automotive and Severe
Environment Protection Circuit
Hall IC
C1
C2
4.7nF
V
DD
Vss
OUT
R
L
1.2K
Supply
Voltage
D1
R
1
100
Z1
4.7 nF
3901005881
Page 6
Aug/02
Rev. 005
Physical Characteristics
U58
945
1
2
3
*
All Dimensions in millimeters
2.13
1.87
0.45
0.41
Marked
Surface
1.53
1.27
UA Hall Plate / Chip Location
1.60
1.40
45
o
Typical
4.30
3.90
2.64
2.34
0.84
0.63
3.20
2.80
1.75
1.55
0.48
0.43
0.20
0.00
0.41
0.35
1.30
1.24
2.57
2.51
5
o
Typical
45
o
Typical
0.38
Typical
(see note 3)
15.5
14.5
0.41
0.35
UA Package Dimensions
* MARKING:
Line 1:
1st digit (U)
= Supplier (Melexis)
2nd and 3rd digits (58)
= Series (5880)
Line 2:
1st digit (9)
= Year (1999)
2nd and 3rd digits(45)
= Week of Year
PINOUT:
Pin 1
V
DD
Pin 2
GND
Pin 3
Output
NOTES:
1.) Controlling dimension: mm.
2.) Leads must be free of flash and
plating voids.
3.) Do not bend leads within 1mm of
lead to package interface.
4.) Package dimensions exclude
molding flash.
5.) Tolerance is +/- 0.254 mm unless
otherwise specified.
SOT-23 Hall Plate /
Chip Location
(Bottom View)
SOT-23 Package Dimensions
(Top View)
NOTES:
1. MARKING:
1st Digit (1) = Series (1880)
2nd Digit(6) = Year - 1996
Last Digits (51) = W eek of Year
2. PINOUT (See Top View at left):
Pin 1
VDD
Pin 2
Output
Pin 3
GND
3. Controlling dimension: mm.
4. Lead thickness after solder plating will be 0.254
mm maximum.
5. Package dimensions exclude molding flash.
6. The end flash shall not exceed 0.127 mm on each
side of package.
7. Tolerance is +/- 0.254 mm unless otherwise
specified.
1.55
1.45
0.95
0.85
1651
1.30
1.00
0.10
0.00
3.10
2.70
3.00
2.60
0.50
0.35
1.80
1.50
chip
0.66
0.56
0.20
MIN
0.25
0.10
2.10
1.70
0.90
0.70
*
1
2
3
Pin #
3901005881
Page 7
Aug/02
Rev. 005
Reliability Information
Melexis devices are classified and qualified regarding suitability for infrared, vapor phase and
wave soldering with usual (63/37 SnPb-) solder (melting point at 183degC).
The following test methods are applied:

IPC/JEDEC J-STD-020A (issue April 1999)
Moisture/Reflow Sensitivity Classification For Nonhermetic Solid State Surface Mount Devices
CECC00802 (issue 1994)
Standard Method For The Specification of Surface Mounting Components (SMDs) of Assessed
Quality
MIL 883 Method 2003 / JEDEC-STD-22 Test Method B102
Solderability

For all soldering technologies deviating from above mentioned standard conditions (regarding
peak temperature, temperature gradient, temperature profile etc) additional classification and
qualification tests have to be agreed upon with Melexis.

The application of Wave Soldering for SMD's is allowed only after consulting Melexis regarding
assurance of adhesive strength between device and board.

For more information on manufacturability/solderability see quality page at our website:
http://www.melexis.com/
ESD Precautions

Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor
products.
3901005881
Page 8
Aug/02
Rev. 005
Disclaimer
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appear-
ing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description re-
garding the information set forth herein or regarding the freedom of the described devices from pat-
ent infringement. Melexis reserves the right to change specifications and prices at any time and with-
out notice. Therefore, prior to designing this product into a system, it is necessary to check with
Melexis for current information. This product is intended for use in normal commercial applications.
Applications requiring extended temperature range, unusual environmental requirements, or high
reliability applications, such as military, medical life-support or life-sustaining equipment are specifi-
cally not recommended without additional processing by Melexis for each application.
The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall
not be liable to recipient or any third party for any damages, including but not limited to personal in-
jury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental
or consequential damages, of any kind, in connection with or arising out of the furnishing, perform-
ance or use of the technical data herein. No obligation or liability to recipient or any third party shall
arise or flow out of Melexis' rendering of technical or other services.
2002 Melexis NV. All rights reserved.
For the latest version of this document, go to our website at:
www.melexis.com
Or for additional information contact Melexis Direct:
Europe and Japan:
All other locations:
Phone: +32 13 67 04 95
Phone: +1 603 223 2362
E-mail: sales_europe@melexis.com
E-mail: sales_usa@melexis.com



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