in automotive camshaft sensing as well as other
speed sensing applications. It is designed to be
used with a bias magnet south facing the back
(non-marked) side of the IC. The device has an
open collector output which is short circuit
The MLX90217 is a sophisticated IC featuring an
on-chip 10-bit A/D Converter and logic that acts
as a digital sample and hold circuit. A separate 4-
bit A/D converter provides a fixed hysteresis. The
90217 does not have a chopper delay. The 90217
uses a single Hall plate which is immune to rotary
alignment problems. The bias magnet can be
from 50 to 400mT.
As the signal is sampled, the logic recognizes an
increasing or decreasing flux density. The output
will turn on (BOP) after the flux has reached its
peak and decreased by an amount equal to the
hysteresis. Similarly the output will turn off (BOP)
after the flux has reached its minimum value and
increased by an amount equal to the hysteresis
Analog Magnetic Signal
Irregular Magnetic Signal
Regular Magnetic Signal
hysteresis is fixed at 5.0 mT. Best angular
accuracy will be obtained when the magnetic
circuit provides peak magnetic flux at the chip
near the high end of the linear range of 500 mT.
EMC protection using external components are
recommended. Two possibilities are shown on
the following page. Normally the South pole faces
the unbranded side of the device. A North pole
will enable a test sequence used in factory
(output driver is off) whatever the field is. The
output only changes after the first min is detected.
The reset state holds no information about the
field. If the supply of the chip is raised slowly, the
reset state is not stable. This has been observed
at 0 field but it should be the same with small and
Gear tooth sensors often need to be adjusted
after the module is assembled to align the
magnet with differential Hall plates or orient with
teeth. However the MLX90217 is "self adjusting"
over a wide range of back bias flux eliminating
the need for any trimming in the application. The
magnet may be glued to the back surface (non
branded side) of the IC using a cyanoacrylate
adhesive or suitable epoxy.
C2 = 2.2nF
First Line (AB) = series & die revision.
Pin 2 - VSS (GND)
Pin 3 - Output (open collector)
1-Controling Dimension: mm
2-Leads must be free of flash and
3-Leads must not arc toward
the rear of package
(4) = Lot Identification.
(9) = Year 1999.
(36) = Week of Year.
wave soldering with usual (63/37 SnPb-) solder (melting point at 183degC).
The following test methods are applied:
IPC/JEDEC J-STD-020A (issue April 1999)
Moisture/Reflow Sensitivity Classification For Nonhermetic Solid State Surface Mount Devices
CECC00802 (issue 1994)
Standard Method For The Specification of Surface Mounting Components (SMDs) of Assessed
MIL 883 Method 2003 / JEDEC-STD-22 Test Method B102
For all soldering technologies deviating from above mentioned standard conditions (regarding
peak temperature, temperature gradient, temperature profile etc) additional classification and
qualification tests have to be agreed upon with Melexis.
The application of Wave Soldering for SMD's is allowed only after consulting Melexis regarding
assurance of adhesive strength between device and board.
For more information on manufacturability/solderability see quality page at our website:
Always observe Electro Static Discharge control procedures whenever handling semiconductor
ing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description re-
garding the information set forth herein or regarding the freedom of the described devices from pat-
ent infringement. Melexis reserves the right to change specifications and prices at any time and with-
out notice. Therefore, prior to designing this product into a system, it is necessary to check with
Melexis for current information. This product is intended for use in normal commercial applications.
Applications requiring extended temperature range, unusual environmental requirements, or high
reliability applications, such as military, medical life-support or life-sustaining equipment are specifi-
cally not recommended without additional processing by Melexis for each application.
The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall
not be liable to recipient or any third party for any damages, including but not limited to personal in-
jury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental
or consequential damages, of any kind, in connection with or arising out of the furnishing, perform-
ance or use of the technical data herein. No obligation or liability to recipient or any third party shall
arise or flow out of Melexis' rendering of technical or other services.
© 2002 Melexis NV. All rights reserved.