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Datasheet: AAA5060SYEVGEC (Kingbright Corporation)

Material: Ingaalp, Ingan, Wavelength: 595nm/525nm

 

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Kingbright Corporation
SPEC NO:DSAD0906
REV NO: V.3 DATE:JUN/16/2003
PAGE: 1 OF 5
APPROVED: J.Lu
CHECKED: Allen Liu DRAWN: X.T.HU
5.0mm x 6.0mm BI-COLOR SURFACE MOUNT
LED LAMP
Package Dimensions
Features
l
CHIPS CAN BE CONTROLLED SEPARATELY.
l
SUITABLE FOR ALL SMT ASSEMBLY AND
SOLDER PROCESS.
l
AVAILABLE ON TAPE AND REEL.
l
PACKAGE: 500PCS / REEL.
AAA5060SYEVGEC SUPER BRIGHT YELLOW
GREEN
Description
The Super Bright Yellow source color devices are made
with DH InGaAlP on GaAs substrate Light Emitting Diode.
The Green source color devices are made with
InGaN on SiC Light Emitting Diode.
Static electricity and surge damage the LEDS.
It is recommended to use a wrist band or
anti-electrostatic glove when handling the LEDs.
All devices, equipment and machinery must be
electrically grounded.
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.25(0.01") unless otherwise noted.
3. Specifications are subject to change without notice.
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
SPEC NO:DSAD0906
REV NO: V.3 DATE:JUN/16/2003
PAGE: 2 OF 5
APPROVED: J.Lu
CHECKED: Allen Liu DRAWN: X.T.HU
Selection Guide
Electrical / Optical Characteristics at T
A
=25


C
Absolute Maximum Ratings at T
A
=25


C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
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Notes:
1
.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
2. * Luminous intensity with asterisk is measured at 50mA.
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SPEC NO:DSAD0906
REV NO: V.3 DATE:JUN/16/2003
PAGE: 3 OF 5
APPROVED: J.Lu
CHECKED: Allen Liu DRAWN: X.T.HU
AAA5060SYEVGEC
Super Bright Yellow
SPEC NO:DSAD0906
REV NO: V.3 DATE:JUN/16/2003
PAGE: 4 OF 5
APPROVED: J.Lu
CHECKED: Allen Liu DRAWN: X.T.HU
Green
SPEC NO:DSAD0906
REV NO: V.3 DATE:JUN/16/2003
PAGE: 5 OF 5
APPROVED: J.Lu
CHECKED: Allen Liu DRAWN: X.T.HU
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
AAA5060SYEVGEC
SMT Reflow Soldering Instruction
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
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