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Datasheet: L468 (IXYS Corporation)

Dual HiPerFREDTM Epitaxial Diode in ISOPLUS i4-PACTM

 

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IXYS Corporation
2001 IXYS All rights reserved
1 - 2
V
RRM
= 2400 V
I
F(AV)M
= 55 A
t
rr
= 220 ns
Dual HiPerFRED
TM
Epitaxial Diode
in ISOPLUS i4-PAC
TM
Advanced Technical Information
DSEE 55-24N1F
Data according to IEC 60747 and refer to a single diode unless otherwise stated.
IXYS reserves the right to change limits, test conditions and dimensions.
1
5
Features
HiPerFRED
TM
Epitaxial Diodes
- fast and soft reverse recovery
low switching losses
- avalanche rated
- low leakage current
ISOPLUS i4-PAC
TM
package
- isolated back surface
- low coupling capacity between pins
and heatsink
- enlarged creepage towards heatsink
- enlarged creepage between pins
- application friendly pinout
- high reliability
- industry standard outline
Applications
rectifiers
- high frequency rectifiers, output
rectifiers of switched mode power
supplies
- mains rectifiers with minimized
emission of disturbances
diodes in snubber networks
high voltage diodes using the series
connection in the component
Rectifier Bridge
Symbol
Conditions
Maximum Ratings
V
RRM
2400
V
V
RRM
1200
V
I
FAV
T
C
= 90C; sine 180
53
A
I
F(AV)M
T
C
= 90C; d = 0.5 rectangular
55
A
I
FSM
T
VJ
= 25C; t = 10 ms; sine 50 Hz
500
A
E
AS
I
AS
= 16 A; L
AS
= 180 H; T
C
= 25C; non repetitive
28
mJ
P
tot
T
C
= 25C
(per diode)
200
W
Symbol
Conditions
Characteristic Values
(T
VJ
= 25
C, unless otherwise specified)
min.
typ.
max.
V
F
I
F
= 40 A; T
VJ
= 25C
2.0
2.5
V
T
VJ
= 125C
1.5
V
I
R
V
R
= V
RRM
;
T
VJ
= 25C
1
mA
T
VJ
= 125C
1
mA
I
RM
I
F
= 75 A; di
F
/dt = -750 A/s; T
VJ
= 125C
79
A
t
rr
V
R
= 600 V
220
ns
R
thJC
(per diode)
0.63 K/W
Data according to IEC 60747 and refer to a single diode unless otherwise stated.
Diodes connected in series
3
117
1
3
5
2001 IXYS All rights reserved
2 - 2
DSEE 55-24N1F
Component
Symbol
Conditions
Maximum Ratings
T
VJ
-55...+150
C
T
stg
-55...+125
C
V
ISOL
I
ISOL
1 mA; 50/60 Hz
2500
V~
F
C
mounting force with clip
20...120
N
Symbol
Conditions
Characteristic Values
min.
typ.
max.
C
P
coupling capacity between
40
pF
shorted pins and mounting tab in the case
d
S
, d
A
pin - pin
5.5
mm
d
S
, d
A
pin - backside metal
5.5
mm
R
thCH
with heatsink compound
0.15
K/W
Weight
9
g
Dimensions in mm (1 mm = 0.0394")
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