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Datasheet: H2585 (Hi-Sincerity Mocroelectronics)

Pnp Epitaxial Planar Transistor

 

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Hi-Sincerity Mocroelectronics
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6715
Issued Date : 1996.02.01
Revised Date : 2001.05.28
Page No. : 1/3
H2585
HSMC Product Specification
H2585
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The H2585 is designed for use in low voltage and low drop out
regulator applications.
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150
C
Junction Temperature ..................................................................................... 150
C Maximum
Maximum Power Dissipation
Total Power Dissipation (Tc=25
C) .................................................................................... 40 W
Maximum Voltages and Currents (Ta=25
C)
VCBO Collector to Base Voltage ....................................................................................... -20 V
VCEO Collector to Emitter Voltage .................................................................................... -15 V
VEBO Emitter to Base Voltage ............................................................................................ -5 V
IC Collector Current ............................................................................................................. -5 A
Characteristics
(Ta=25
C)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
*BVCEO
-15
-
-
V
IC=-100mA
BVCBO
-20
-
-
V
IC=-10mA
ICBO
-
-
-10
uA
VCB=-20V
ICEO
-
-
-20
uA
VCE=-15V
IEBO
-
-
-2
mA
VEB=-5V
*VCE(sat)1
-
-
-1.5
V
IC=-3A, IB=-3mA
*VCE(sat)2
-
-
-1.5
V
IC=-5A, IB=-5mA
VBE(on)
-
-
-2
V
IC=-3A, VCE=-1.7V
*hFE1
1
-
60
K
IC=-500mA, VCE=-1.7V
*hFE2
1
-
60
K
IC=-5A, VCE=-1.7V
Cob
-
-
100
pF
VCB=-10V
*Pulse Test : Pulse Width
380us, Duty Cycle
2%
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6715
Issued Date : 1996.02.01
Revised Date : 2001.05.28
Page No. : 2/3
H2585
HSMC Product Specification
Characteristics Curve
Current Gain & Collector Current
100
1000
10000
10
100
1000
10000
Collector Current (mA)
C
u
r
r
e
n
t Ga
i
n
(
h
F
E
)
Saturation Voltage & Collector Current
100
1000
10000
1
10
100
1000
10000
Collector Current (mA)
S
a
tu
r
a
ti
o
n
V
o
l
t
a
g
e
(
m
V
)
On Voltage & Collector Current
1000
10000
10
100
1000
10000
Collector Current (mA)
On
V
o
l
t
a
g
e
(
m
V
)
Output Capacitance &
Reverse-Biased Voltage
10
100
1000
0.1
1
10
100
Reverse-Biased Voltage (V)
Ou
tp
u
t
C
a
p
a
c
i
t
a
n
c
e
(
p
F
)
Switching Times & Collector Current
10
100
1000
1000
10000
Collector Current (mA)
S
w
i
t
ch
i
n
g
T
i
m
e
s (
n
s)
Safe Operating Area
1
10
100
1000
10000
100000
1
10
100
Forward Biased Voltage (V)
C
lle
c
t
o
r
C
u
r
r
e
n
t
(
m
A
)
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6715
Issued Date : 1996.02.01
Revised Date : 2001.05.28
Page No. : 3/3
H2585
HSMC Product Specification
TO-220AB Dimension
*:Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.2197
0.2949
5.58
7.49
I
-
*
0.1508
-
*
3.83
B
0.3299
0.3504
8.38
8.90
K
0.0295
0.0374
0.75
0.95
C
0.1732
0.185
4.40
4.70
M
0.0449
0.0551
1.14
1.40
D
0.0453
0.0547
1.15
1.39
N
-
*
0.1000
-
*
2.54
E
0.0138
0.0236
0.35
0.60
O
0.5000
0.5618
12.70
14.27
G
0.3803
0.4047
9.66
10.28
P
0.5701
0.6248
14.48
15.87
H
-
*
0.6398
-
*
16.25
Notes :
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
Lead : 42 Alloy ; solder plating
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056
Fax : 886-2-25632712, 25368454
Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
A
B
E
G
I
K
M
O
P
3
2
1
C
N
H
D
4
Style : Pin 1.Base 2.Collector 3.Emitter
3-Lead TO-220AB Plastic Package
HSMC Package Code : E
Marking :
HSMC Logo
Part Number
Date Code
Product Series
Rank
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