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Datasheet: H1N5818 (Hi-Sincerity Mocroelectronics)

1.0AMP.SCHOTTKY BARRIER RECTIFIERS

 

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Hi-Sincerity Mocroelectronics
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HL200101
Issued Date : 2000.01.15
Revised Date : 2001.12.06
Page No. : 1/3
H1N5817, H1N5818, H1N5819
HSMC Product Specification
H1N5817
thru
H1N5819
1.0 AMP. SCHOTTKY BARRIER RECTIFIERS
Features
Low Forward Voltage Drop
High Current Capability
High Reliability
High Surge Current Capability
Maximum Ratings
Ratings at 25
C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz,
resistive or inductive load. For capacitive load, derate current by 20%.
Type Number
H1N5817 H1N5818 H1N5819
Units
Maximum Recurrent Peak Reverse Voltage
20
30
40
V
Maximum RMS Voltage
14
21
28
V
Maximum DC Blocking Voltage
20
30
40
V
Maximum Average Forward Rectified Current
0.375"(9.5mm) Lead Length @ TL=90
C
1
A
Peak Forward Surge Current, 8.3ms Single Half
Sine-wave Superimposed on Rated Load (JEDEC
method)
25
A
Maximum Instantaneous Forward Voltage @ 1A
0.45
0.550
0.600
V
Maximum Instantaneous Forward Voltage @ 3A
0.750
0.875
0.900
V
Maximum DC Reverse Current At Rated DC
Blocking Voltage
1 (@ Ta=25
C)
10 (@ Ta=100
C)
mA
mA
Typical Thermal Resistance
(Note 1)
R
JA
50
C /W
Typical Junction Capacitance
(Note 2)
110
pF
Operating Temperature Range Tj
-65 to +125
C
Storage Temperature Range TSTG
-65 to +125
C
Note 1: Thermal resistance from junction to ambient vertical PC Board Mounting, 0.375"(9.5mm) lead length.
Note 2: Measured at 1Mhz and applied reverse voltage of 4V D.C.
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HL200101
Issued Date : 2000.01.15
Revised Date : 2001.12.06
Page No. : 2/3
H1N5817, H1N5818, H1N5819
HSMC Product Specification
Characteristics Curve
Fig.1 - Maximum Forward Current Derating Curve
0.00
0.25
0.50
0.75
1.00
0
25
50
75
100
125
150
175
Lead Temperature (
o
C)
A
v
er
ag
e Fo
r
w
ar
d C
u
r
r
en
t
(
A
)
Fig.2 - Typical Junction Capactitance
10
100
1000
0.1
1
10
100
Reverse Voltage (V)
C
a
pa
c
i
t
anc
e
(
p
F)
Fig.3 - Typical Forward Characteristics
0.1
1
10
100
0.1
0.3
0.5
0.7
0.9
1.1
1.3
1.5
1.7
1.9
2.1
Forward Soltage (V)
I
n
s
t
an
t
a
n
e
o
u
s
Fo
r
w
ar
d C
u
r
r
en
t
(
A
)
.
H1N5817
H1N5818,H1N5819
Tj=25
o
C
Pulse Width=300us
1% Duty Cycle
Fig.4 - Maximum Non-Repetitive Forward Surge Current
0
5
10
15
20
25
30
1
10
100
Number Of Cycles At 60Hz
P
e
a
k
F
o
r
w
ar
d S
u
r
g
e C
u
r
r
en
t
(
A
)
8.3ms Single Half Sine
Wave JIDIC Method
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HL200101
Issued Date : 2000.01.15
Revised Date : 2001.12.06
Page No. : 3/3
H1N5817, H1N5818, H1N5819
HSMC Product Specification
DO-41 Dimension
*: Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.0280
0.0340
0.71
0.86
D
1.0000
-
25.40
-
B
1.0000
-
25.40
-
E
0.0800
0.1070
2.00
2.70
C
0.1600
0.2050
4.10
5.20
Notes:
1.Dimension and tolerance based on our Spec. dated May 28,1998.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
Lead: 42 Alloy ; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
E
B
C
A
D
DO-41 Molded Plastic Package
HSMC Package Code: L
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