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Datasheet: H1N4007 (Hi-Sincerity Mocroelectronics)

General Purpose Rectifiers

 

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Hi-Sincerity Mocroelectronics
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE9101-B
Issued Date : 1996.03.27
Revised Date : 2000.05.01
Page No. : 1/2
HSMC Product Specification
H1N400X Series
General Purpose Rectifiers
Features
High Reliability
Low Cost
Low Leakage
Low forward voltage drop
High Current Capability
Glass Passivated Junction
Maximum Ratings & Electrical Characteristics
Ratings at 25
C ambient temperature unless otherwise specified. Single phase, half wave, 60
Hz, resistive or inductive load. For capacitive load. Drate current by 20%.
Ratings
Symbol
4001
4002
4004
4007
Unit
Maximum recurrent peak reverse voltage
V
RRM
50
100
400
1000
V
Maximum RMS voltage
V
RMS
35
70
280
700
V
Maximum DC blocking voltage
V
DC
50
100
400
1000
V
Maximum average forward recitified current
.375"(9.5mm) lead length (Ta=75
C)
I
O
1
A
Peak forward surge current 8.3ms single half
sine-wave superimposed on rated load
I
FSM
30
A
Typical thermal resistance
(Note2)
R
JA
50
C/W
Typical junction capacitance
(Note1)
C
J
30
pF
Operating & storage temperature Tj
T
stg
-50 to +175
C
Maximum instantaceous forward voltage at
1.0A DC
V
F
1.1
V
Maximum DC reverse current at rated DC
blocking voltage @Ta=25
C
@Ta=100
C
I
R
5
50
uA
Maximum full load reverse current average
full cycle .375"(9.5mm) lead at Tj=75
C
30
uA
Note 1 : Measured at 1MHz and applied reverse voltage of 4.0 volts.
Note 2 : Thermal resistance from junction to ambient 9.5mm lead length.
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE9101-B
Issued Date : 1996.03.27
Revised Date : 2000.05.01
Page No. : 2/2
HSMC Product Specification
DO-41 Dimension
*:Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.0280
0.0340
0.71
0.86
D
1.0000
-
25.40
-
B
1.0000
-
25.40
-
E
0.0800
0.1070
2.00
2.70
C
0.1600
0.2050
4.10
5.20
Notes :
1.Dimension and tolerance based on our Spec. dated May 28,1998.a
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
Lead : 42 Alloy ; solder plating
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
E
B
C
A
D
DO-41 Molded Plastic Package
HSMC Package Code : L
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