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Datasheet: 13003BR (Hi-Sincerity Mocroelectronics)

Npn Epitaxial Planar Transistor

 

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Hi-Sincerity Mocroelectronics
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HT200210
Issued Date : 2001.01.01
Revised Date : 2002.05.08
Page No. : 1/3
HMJE13003
HSMC Product Specification
HMJE13003
NPN EPITAXIAL PLANAR TRANSISTOR
Description
High Voltage, High Speed Power Switch
Switch Regulators
PWM Inverters and Motor Controls
Solenoid and Relay Drivers
Deflection Circuits
Absolute Maximum Ratings
(Ta=25
C)
Maximum Temperatures
Storage Temperature ............................................................................................ -50 ~ +150
C
Junction Temperature ...................................................................................... 150
C Maximum
Maximum Power Dissipation
Total Power Dissipation (Tc=25
C) ..................................................................................... 40 W
Maximum Voltages and Currents (Ta=25
C)
VCEX Collector to Emitter Voltage .................................................................................... 700 V
VCEO Collector to Emitter Voltage .................................................................................... 400 V
VEBO Emitter to Base Voltage .............................................................................................. 9 V
IC Collector Current ........................................................................................ Continuous 1.5 A
IB Base Current............................................................................................. Continuous 0.75 A
Characteristics
(Ta=25
C)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
BVCEX
700
-
-
V
IC=1mA, VBE(off)=1.5V
BVCEO
400
-
-
V
IC=10mA
IEBO
-
-
1
mA
VEB=9V
ICEX
-
-
1
mA
VCE=700V, VBE(off)=1.5V
*VCE(sat)1
-
-
500
mV
IC=0.5A, IB=0.1A
*VCE(sat)2
-
-
1
V
IC=1A, IB=0.25A
*VCE(sat)3
-
-
3
V
IC=1.5A, IB=0.5A
*VBE(sat)
-
-
1
V
IC=0.5A, IB=0.1A
*VBE(sat)
-
-
1.2
V
IC=1A, IB=0.25A
*hFE1
8
-
40
IC=0.5A, VCE=2V
*hFE2
5
-
25
IC=1A, VCE=2V
*Pulse Test: Pulse Width
380us, Duty Cycle
2%
TO-126
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HT200210
Issued Date : 2001.01.01
Revised Date : 2002.05.08
Page No. : 2/3
HMJE13003
HSMC Product Specification
Characteristics Curve
Current Gain & Collector Current
1
10
100
0.1
1
10
100
1000
10000
Collector Current-IC (mA)
hFE
25
o
C
75
o
C
125
o
C
hFE @ V
CE
=2V
Saturation Voltage & Collector Current
10
100
1000
1
10
100
1000
10000
Collector Current-I
C
(mA)
S
a
tu
r
a
ti
o
n
V
o
l
t
a
g
e
(
m
V
)
25
o
C
75
o
C
125
o
C
V
CE(sat)
@ I
C
=3I
B
Saturation Voltage & Collector Current
10
100
1000
10000
1
10
100
1000
10000
Collector Current-I
C
(mA)
S
a
t
u
r
a
t
i
on V
o
l
t
a
ge (
m
V
)
125
o
C
75
o
C
25
o
C
V
CE(sat)
@ I
C
=4I
B
Saturation Voltage & Collector Current
10
100
1000
10000
1
10
100
1000
10000
Collector Current-I
C
(mA)
S
a
tu
r
a
ti
o
n
V
p
l
t
a
g
e
(
m
V
)
25
o
C
125
o
C
75
o
C
V
CE(sat)
@ I
C
=5I
B
Saturation Voltage & Collector Current
100
1000
10000
1
10
100
1000
10000
Collector Current-I
C
(mA)
S
a
tu
r
a
ti
o
n
V
o
l
t
a
g
e
(
m
V
)
125
o
C
25
o
C
75
o
C
V
BE(sat)
@ I
C
=4I
B
Saturation Voltage & Collector Current
100
1000
10000
1
10
100
1000
10000
Collector Current-I
C
(mA)
Sa
t
u
r
a
t
i
o
n
Vo
l
t
a
g
e
(
m
V)
25
o
C
75
o
C
125
o
C
V
BE(sat)
@ I
C
=5I
B
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HT200210
Issued Date : 2001.01.01
Revised Date : 2002.05.08
Page No. : 3/3
HMJE13003
HSMC Product Specification
TO-126 Dimension
*: Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
1
-
*3
-
*3
F
0.0280
0.0319
0.71
0.81
2
-
*3
-
*3
G
0.0480
0.0520
1.22
1.32
3
-
*3
-
*3
H
0.1709
0.1890
4.34
4.80
4
-
*3
-
*3
I
0.0950
0.1050
2.41
2.66
A
0.1500
0.1539
3.81
3.91
J
0.0450
0.0550
1.14
1.39
B
0.2752
0.2791
6.99
7.09
K
0.0450
0.0550
1.14
1.39
C
0.5315
0.6102
13.50
15.50
L
-
*0.0217
-
*0.55
D
0.2854
0.3039
7.52
7.72
M
0.1378
0.1520
3.50
3.86
E
0.0374
0.0413
0.95
1.05
Notes:
1.Dimension and tolerance based on our Spec. dated Mar. 6,1995.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
A
B
C
F
D
E
H
1 2 3
K
J
I
3
4
L
M
1
2
G
Style: Pin 1.Base 2.Collector 3.Emitter
3-Lead TO-126 Plastic Package
HSMC Package Code: T
Marking:
Date Code
Control Code
H
E
1 3 0
M J
0 3
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