HTML datasheet archive (search documentation on electronic components) Search datasheet (1.687.043 components)
Search field

Datasheet: M1DA (No company)

Same Rosc In En/de S.o.dip

 

Download: PDF   ZIP
No company
SAME Rosc in EN/DE
S.O.DIP
1/3
2004-07-15
EN/DECODER
M1EA/DA
TAIPEI : TEL : 886-2- 22783733
FAX : 886-2- 22783633
H.K. : TEL : 852- 27569109
FAX : 852- 27566961
EN/DE
/
MOSDESIGN SEMICONDUCTOR CORP.
FEATURES
ˇ
Momentary DATA suffix-M.
ˇ
S.O.Package 18P suffix-S.
ˇ
Direct Data Transmit suffix-H : switch to VDD.
APPLICATION
ˇ
Security alarm, Remote control. , .
ELECTRICAL CHARACTERISTICS
Characteristics
Sym.
Min.
Typ.
Max.
Unit
REMARKS
Operating Voltage
V
DD
2.4
13
V
Operating Current
I
OP
0.1
1
mA
No load
Quiescent Current
I
SB
1
10
uA
Driving Current
I
OL
2
mA
@ V
DS
=1.2V
Oscillator Frequency
F
OSC
76
KHz Externalą30%
Operating Temperature
Temp.
-20
25
60
APPLICATION DIAGRAM
* Rosc~M1EA : 270 K, M1DA : 270 K
* All specs and applications shown above subject to change without prior notice.
( , )
BIT FORMAT
"1"
"0"
DATA
PROTOCOL
TE
DO
VT
D0~3
T T T
A5
A0
A1
A2
A3
A4
A6
A7
VSS
A11/D3
VDD
DO
X
Y
TE
A10/D2
A9/D1
A8/D0
IR / RF
Rosc
M1EA
1
18
9
10
A5
A0
A1
A2
A3
A4
A6
A7
VSS
VDD
VT
Y
X
A11/D3
A10/D2
A9/D1
A8/D0
DIN
IR / RF
Rosc
M1DA
1
18
9
10
SAME Rosc in EN/DE
S.O.DIP
2/3
2004-07-15
EN/DECODER
M1EA/DA
TAIPEI : TEL : 886-2- 22783733
FAX : 886-2- 22783633
H.K. : TEL : 852- 27569109
FAX : 852- 27566961
EN/DE
/
MOSDESIGN SEMICONDUCTOR CORP.
APPLICATION DIAGRAM
CHIP FORM
* Rosc~M1EA : 270 K, M1DA : 270 K
* All specs and applications shown above subject to change without prior notice.
( , )
D3
A5
A0
A1
A2
A3
A4
A6
A7
VSS
X
VDD
IR / RF
Rosc
DO
M1EA
=VDD
1.80 X1.81 mm
2
D2
D1
D0
Y
TE
M1DA
=VDD
2.60 X 2.60 mm
2
A1
VSS
A5
A2
A3
A4
A6
A7
IR / RF
A0 VDD
VT
X
Y
Rosc
DIN
D3
D1
D0
D2
SAME Rosc in EN/DE
S.O.DIP
3/3
2004-07-15
EN/DECODER
M1EA/DA
TAIPEI : TEL : 886-2- 22783733
FAX : 886-2- 22783633
H.K. : TEL : 852- 27569109
FAX : 852- 27566961
EN/DE
/
MOSDESIGN SEMICONDUCTOR CORP.
PAD ASSIGNMENT & POSITION
M1EA
M1DA
* M1EA CHIP SIZE ~ 1.80 X 1.81 mm
2
* M1DA CHIP SIZE ~ 2.60 X 2.60 mm
2
* IC substrate should be connected to VDD in PCB (PCB IC VDD)
UNIT : um
No.
NAME
X
Y
1
A10 / D2
728
732.5
2
A11 / D3
528
732.5
3
TEB
211
732.5
4
Y
-31.5
732.5
5
X
-728.5
732.5
6
DOUT
-728.5
376.5
7
VDD
-728.5
36
8
A0
-728.5
-164
9
A1
-728.5
-533
10 A2
-728.5
-733
11 A3
-480.5
-733
12 A4
-101
-733
13 A5
184
-733
14 A6
480
-733
15 A7
728
-733
16 VSS
728
-66
17 A8 / D0
728
183
18 A9 / D1
728
431.5
( 0,0 )
X
Y
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
17
18
16
UNIT : um
No.
NAME
X
Y
1
X
259.5
1096.5
2
VT
-9.5
1096.5
3
VDD
-347
1096.5
4
A0
-547
1096.5
5
A1
-950
1096.5
6
A2
-1150
1025
7
A3
-1150
702
8
A4
-1150
502
9
A5
-1150
179
10 A6
-1043
-1100
11 A7
-799.5
-1100
12 VSS
-599.5
-1100
13 A8 / D0
-251
-1100
14 A9 / D1
169
-1100
15 A10 / D2
696
-1100
16 A11 / D3
1145.5
-946
17 DIN
1086
590
18 Y
1086
790
1
2
3
4
5
6
7
8
9
10
11 12
13
14
15
17
18
16
( 0,0 )
X
Y
© 2018 • ICSheet
Contact form
Main page