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Datasheet: J4G (Diotec Semiconductor)

 

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Diotec Semiconductor
FEATURES
Data Sheet No. FSPD-200-1B
MECHANICAL SPECIFICATION
Tel.: (310) 767-1052
Fax: (310) 767-7958
DIOTEC ELECTRONICS CORP.
Gardena, CA 90248
U.S.A
18020 Hobart Blvd., Unit B
Operating and Storage Temperature Range
T T
J,
STG
C
Typical Junction Capacitance (Note 1)
C
J
pF
15
-65 to +175
4.97ffspd200
(1) Measured at 1MHz & applied reverse voltage of 4 volts
(2) 300 nS available - consult factory
NOTES:
Case: JEDEC DO-41 molded plastic (U/L Flammability Rating 94V-0)
Terminals: Plated axial leads
Soldering: Per MIL-STD 202 Method 208 guaranteed
Polarity: Color band denotes cathode
Mounting Position: Any
Weight: 0.01 Ounces (0.4 Grams)
H29
MECHANICAL DATA
Color Band
Denotes
Cathode
LD (Dia)
BD (Dia)
LL
BL
LL
SERIES RGP200 - RGP210
MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive loads, derate current by 20%.
Average Forward Rectified Current @ T = 75 C,
Lead length = 0.375 in. (9.5 mm)
A
o
PARAMETER (TEST CONDITIONS)
Maximum DC Blocking Voltage
Peak Forward Surge Current ( 8.3 mSec single half sine wave
superimposed on rated load)
Maximum Forward Voltage at 2 Amps DC
Maximum Average DC Reverse Current
At Rated DC Blocking Voltage
Maximum Peak Recurrent Reverse Voltage
Maximum RMS Voltage
Series Number
I
RM
T
RR
I
O
V
RMS
V
RRM
V
RM
SYMBOL
RATINGS
VOLTS
AMPS
UNITS
VOLTS
A
V
FM
I
FSM
200
400
140
280
200
800
560
800
400
2
60
1.3
150
1.0
100
@ T = 25 C
A
o
@ T = 100 C
A
o
Maximum Reverse Recovery Time (I =0.5A, I =1A, I
=0.25A)
F
R
RR
200
201
202
204
206
208
210
RGP
RGP
RGP
RGP
RGP
RGP
RGP
50
35
50
100
70
100
600
420
600
1000
700
1000
250
500 (Note 2)
nS
ACTUAL SIZE OF
DO-41 PACKAGE
Sym
In
mm
Minimum
Maximum
BL
BD
LL
LD
1.00
0.028
In
mm
0.107
0.205
0.034
5.2
2.7
0.86
0.160
0.103
25.4
0.71
4.1
2.6
DO - 41
EXTREMELY LOW LEAKAGE AT HIGH TEMPERATURES
LOW FORWARD VOLTAGE DROP
2A at T = 75 C WITH NO THERMAL RUNAWAY
A
o
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical < 2%, Max. < 10% of Die Area)
R
PROPRIETARY
JUNCTION
PASSIVATION FOR SUPERIOR RELIABILITY AND
PERFORMANCE
SOFT GLASS
RATING & CHARACTERISTIC CURVES FOR SERIES RGP200 - RGP210
Data Sheet No. FSPD-200-2B
Tel.: (310) 767-1052
Fax: (310) 767-7958
DIOTEC ELECTRONICS CORP.
Gardena, CA 90248
U.S.A
18020 Hobart Blvd., Unit B
FIGURE 1. FORWARD CURRENT DERATING CURVE
Ambient Temperature, C
o
Number of Cycles at 60 Hz
FIGURE 2. MAXIMUM NON-REPETITIVE SURGE CURRENT
2 AMP FAST RECOVERY SILICON DIODES
4.97bfspd200
H30
Single Phase, Half wave, 60 Hz
Resistive and Inductive Loads
Lead Length = 0.375" (9.5 mm)
FIGURE 3. TYPICAL FORWARD CHARACTERISTIC
Instantaneous Forward Voltage (Volts)
0.01
0.1
1.0
10
20
10
FIGURE 4. TYPICAL JUNCTION CAPACITANCE
Reverse Voltage, (Volts)
1
0.1
10
0.1
100
T = 25 C
Pulse Width = 300 S
1% Duty Cycle
J
o
T = 25 C
f = 1 MHz
V
= 50 mV P-P
J
SIG
o
NOTES:
(1) Rise time = 7nS max., input impedance = 1 Megohm, 22 pF
(2) Rise time = 10nS max., source impedance = 50 ohms
FIGURE 5. REVERSE RECOVERY TEST SETUP AND TIME CHARACTERISTIC
1
non-
inductive
10
noninductive
50
noninductive
OSCILLOSCOPE
(Note 1)
PULSE
GENERATOR
(Note 2)
(+)
(+)
(-)
(-)
D.U.T.
25 VDC
(APPROX)
-1.0
-0.5
0.0
0.5
Set time base
for 10nS/cm
1
cm
T
RR
1
10
100
50
40
30
20
10
0
JEDEC Method
8.3 mS Single
Half Sine Wave
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