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Datasheet: CSMA204XSA (Cystech Electonics Corp.)

2.0Amp. Glass Passivated Diodes

 

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Cystech Electonics Corp.
CYStech Electronics Corp.
Spec. No. : C342SA
Issued Date : 2003.08.19
Revised Date :2003.12.05
Page No. : 1/4
CSMA20XSA
CYStek Product Specification
2.0Amp. Glass Passivated Diodes
CSMA20XSA Series
Features
ˇ
For surface mounted applications.
ˇ
Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0
ˇ
Low leakage current
ˇ
High surge capability
ˇ
High temperature soldering: 250
°
C/10 seconds at terminals
ˇ
Exceeds environmental standards of MIL-S-19500/228
Mechanical Data
ˇ
Case: Molded plastic, SMA/JEDEC DO-214AC
ˇ
Terminals: Solder plated, solderable per MIL-STD-750 method 2026
ˇ
Polarity: Indicated by cathode band.
ˇ
Packaging: 12mm tape per EIA STD RS-481.
ˇ
Weight: 0.064 gram, 0.002 ounce
Maximum Ratings and Electrical Characteristics
(
Rating at 25
°
C ambient temperature unless otherwise specified. )
Parameter Symbol Spec
Type
CSMA
201
CSMA
202
CSMA
203
CSMA
204
CSMA
205
CSMA
206
CSMA
207
Units
Repetitive peak reverse voltage
V
RRM
50 100 200 400 600 800 1000 V
Maximum RMS voltage
V
RMS
35 70 140 280 420 560 700 V
Maximum DC blocking voltage
V
R
50 100 200 400 600 800 1000 V
Maximum instantaneous
forward voltage, I
F
=2A
(Note 1)
V
F
1.1 1.1 1.1 1.1 1.1 1.1 1.1 V
Average forward rectified current
I
O
2 A
Peak forward surge current @8.3ms
single half sine wave superimposed
on rated load (JEDEC method)
I
FSM
50 A
Maximum DC reverse current
V
R
=V
RRM
,T
A
=25
(Note 1)
V
R
=V
RRM
,T
A
=125
(Note 1)
I
R
5
125
ľA
ľA
Maximum thermal resistance,
Junction to ambient
R
th,JA
53
(typ) /W
Diode junction capacitance
(Note 2)
C
J
30(typ)
pF
Storage temperature
Tstg
-55 ~ +150
Operating temperature
T
J
-55 ~ +150
Notes : 1. Pulse test, pulse width=300sec, 2% duty cycle
2 . f=1MHz and applied 4.0V
DC
reverse voltage.



CYStech Electronics Corp.
Spec. No. : C342SA
Issued Date : 2003.08.19
Revised Date :2003.12.05
Page No. : 2/4
CSMA20XSA
CYStek Product Specification
Characteristic Curves
Forward Current Derating Curve
0
0.5
1
1.5
2
2.5
0
20
40
60
80
100 120 140 160
Ambient Temperature---T
A
()
Average Forward Current---I
O
(A)
Single Phase, Half
Wave 60Hz, Resistive
or Inductive Load
Forward Current vs Forward Voltage
0.01
0.1
1
10
100
0.6
0.8
1
1.2
1.4
1.6
1.8
2
Forward Voltage---V
F
(V)
Forward Current---I
F
(A)
Tj=25
Pulse Width=300s
Duty Cycle=1%
Maximum Non-Repetitive Forward
Surge Current
0
10
20
30
40
50
60
1
10
100
Numbers of Cycles at 60Hz
Peak Forward Surge Current---
I
FSM
(A)
Tj=25, 8.3ms
Single Half Sine Wave,
JEDEC method
Junction Capacitance vs Reverse Voltage
0
10
20
30
40
50
60
70
80
90
0.01
0.1
1
10
100
Reverse Voltage---V
R
(V)
Junction Capacitance---C
J
(pF)
Reverse Leakage Current vs Reverse Voltage
0.01
0.1
1
10
100
0
20
40
60
80
100
120
140
Percentage of Rated Peak Reverse Voltage---(%)
Reverse Leakage Current---(A)
Tj = 100
Tj = 25

CYStech Electronics Corp.
Spec. No. : C342SA
Issued Date : 2003.08.19
Revised Date :2003.12.05
Page No. : 3/4
CSMA20XSA
CYStek Product Specification
Packing Information
CYStech Electronics Corp.
Spec. No. : C342SA
Issued Date : 2003.08.19
Revised Date :2003.12.05
Page No. : 4/4
CSMA20XSA
CYStek Product Specification
SMA/DO-214AC Dimension
*:Typical
Inches Millimeters
Inches Millimeters
DIM
Min. Max. Min. Max.
DIM
Min. Max. Min. Max.
A 0.177 0.185 4.4 4.8 E 0.060 0.067 1.5 1.7
B 0.094 0.110 2.4 2.8 F
0.04(typ) 1.0(typ)
C 0.012(typ)
0.3(typ) G 0.04(typ)
1.0(typ)
D
0.150
0.165
3.8
4.2
- - - - -
Notes :
1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
ˇ
Lead : 42 Alloy ; solder plating
ˇ
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
ˇ
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
ˇ
CYStek reserves the right to make changes to its products without notice.
ˇ
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
ˇ
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SMA Plastic Surface
Mounted Package
CYStek Package Code: SA
Marking Code:
Device
CSMA
201
CSMA
202
CSMA
203
CSMA
204
Code A21 A22 A23 A24
Device
CSMA
205
CSMA
206
CSMA
207
Code A25 A26 A27
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