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Datasheet: BAS21S2 (Cystech Electonics Corp.)

High Voltage Switching Diode

 

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Cystech Electonics Corp.
CYStech Electronics Corp.

Spec. No. : C335S2
Issued Date : 2003.06.10
Revised Date :
Page No. : 1/4
BAS21S2
CYStek Product Specification
High voltage switching diode
BAS21S2
Description
High voltage switching diode encapsulated in a SOD-323 small plastic SMD package.

Features
Fast switching speed
Low forward voltage drop
Small plastic SMD package
Mechanical Data
Case: Molded Plastic, JEDEC SOD-323.
Terminals: Solder plated, solderable per MIL-STD-750 Method 2026
Polarity: Indicated by cathode band.
Mounting Position : Any.
Weight: 0.0045 gram, 0.000159 ounce
Symbol Outline





SOD-323
CYStech Electronics Corp.

Spec. No. : C335S2
Issued Date : 2003.06.10
Revised Date :
Page No. : 2/4
BAS21S2
CYStek Product Specification
Absolute Maximum Ratings
(Ta=25, unless otherwise specified)
Maximum Temperatures
Storage Temperature Tstg ................................................................................................... -55~+150
C
Junction Temperature Tj ............................................................................................................. +150
C
Maximum Power Dissipation
Total Power Dissipation Ptot
(Note)
........................................................................................... 200 mW
Derate above 25 ................................................................................... 1.57mW/
Maximum Voltages and Currents
Continuous Reverse Voltage V
R
.............................................................................. 250V
Continuous Forward Current I
F
(Note)
..................................................................... 200 mA
Peak Repetitive Forward Current I
FRM
(Note)
............................................................625 mA
Thermal Resistance, Junction to Ambient Air R
JA
.....................................................635/W
Note : Parts mounted on FR-5 board with minimum pad.
Characteristics
(Ta=25
C)
Characteristic Symbol Condition Min.
Max.
Unit
Reverse Breakdown Voltage
V
BR
I
R
=100A 250
-
V
V
F
(1) I
F
=100mA -
1
V
Forward Voltage
(Note)
V
F
(2) I
F
=200mA -
1.25
V
I
R
(1)
V
R
=200V,Tj=25
- 100 nA
Reverse Leakage Current
(Note)
I
R
(2)
V
R
=200V,Tj=150
100
A
Diode Capacitance
C
D
V
R
=0V, f=1MHz
-
5
pF
Reverse Recovery Time
t
rr
I
F
=I
R
=30mA RL=100
measured at I
R
=3mA
- 50 ns
Notes
:
Pulse test, tp=380s, duty cycle<2%.




















CYStech Electronics Corp.

Spec. No. : C335S2
Issued Date : 2003.06.10
Revised Date :
Page No. : 3/4
BAS21S2
CYStek Product Specification
Characteristic Curves
Forward Characteristics
0.01
0.1
1
10
100
1000
0
1
2
Instantaneous Forward Voltage---V
F
(V)
Instantaneous Forward Current---I
F
(mA)
Reverse Leakage Current vs Junction Temperature
0.01
0.1
1
10
100
0
100
200
Junction Temperature---Tj()
Reverse Leakage Current---I
R
(A)
Power Derating Curve
0
50
100
150
200
250
0
50
100
150
200
Ambient Temperature---T
A
()
Power Dissipation---P
D
(mW)
CYStech Electronics Corp.

Spec. No. : C335S2
Issued Date : 2003.06.10
Revised Date :
Page No. : 4/4
BAS21S2
CYStek Product Specification
SOD-323 Dimension
*: Typical
Inches Millimeters
Inches Millimeters
DIM
Min. Max. Min. Max.
DIM
Min. Max. Min. Max.
A
0.0630
0.0709
1.60
1.80
E
0.0060 - 0.15 -
B 0.0453
0.0531 1.15 1.35 H 0.0000 0.0040 0.00 0.10
C 0.0315
0.0394 0.80 1.00 J 0.0035
0.0070
0.089 0.177
D 0.0098
0.0157 0.25 0.40 K 0.0906 0.1063 2.30 2.70
Notes:
1.Controlling dimension : millimeters.
2.Lead thickness specified per L/F drawing with solder plating.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
Lead: 42 Alloy ; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0





Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
D
A
H
J
K
C
E
B
1
2
Style: Pin 1.Cathode 2.Anode
2-Lead SOD-323 Plastic
Surface Mounted Package
CYStek Package Code: S2
Marking:
5 H
JS
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