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Datasheet: L06 (California Micro Devices)

ESD Protection Arrays, Chip Scale Package

 

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California Micro Devices

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2004 California Micro Devices Corp. All rights reserved.
06/28/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
1
CM1206
ESD Protection Arrays, Chip Scale Package
Features
Functionally and pin compatible with CMD's
PACDN2404C/08C/16C family of devices
OptiGuard
TM
coated for improved reliability at
assembly
4, 8, or 16 transient voltage suppressors in a single
package
In-system Electrostatic Discharge (ESD) protection
to +18kV contact discharge per IEC 61000-4-2
international standard
Supports AC signal applications
Compact Chip Scale Package (0.65mm pitch) for-
mat saves board space and eases layout in space
critical applications compared to discrete solutions
and traditional wire bonded packages
Lead-free versions available
Applications
ESD protection for sensitive electronic equipment
I/O port, keypad and button circuitry protection for
portable devices
Wireless Handsets
Handheld PCs / PDAs
MP3 Players
Digital Cameras and Camcorders
Notebooks
Desktop PCs
Product Description
The CM1206 family of transient voltage suppressor
arrays provides a very high level of protection for sensi-
tive electronic components that may be subjected to
ESD. The back-to-back Zener connections provide
ESD protection in cases where nodes with AC signals
are present.
These devices are designed and characterized to
safely dissipate ESD strikes at levels well beyond the
maximum requirements set forth in the IEC 61000-4-2
international standard. All I/Os are rated at +18kV
using the IEC 61000-4-2 contact discharge method.
Using the MIL-STD-883D (Method 3015) specification
for Human Body Model (HBM) ESD, all pins are pro-
tected for contact discharges to greater than +30kV.
The Chip Scale Package format of these devices
enable extremely small footprints that are necessary in
portable electronics such as cellular phones, PDAs,
internet appliances and PCs. The large solder bumps
allow for standard attachment to laminate boards with-
out the use of underfill.
The CM1206 incorporates OptiGuard
TM
coating which
results in improved reliability at assembly. The CM1206
is also available with optional lead-free finishing.
A1
A2
A3
B1
B2
B3
C2
C3
C4
D2
D3
D4
C5
D5
C1
D1
A2
A3
A4
B2
B3
B4
A5
B5
A1
B1
Electrical Schematic
CM1206-04CS/CP
CM1206-08CS/CP
CM1206-16CS/CP
A2
A4
B2
B4
A5
B5
A1
B1
A3
B3
2004 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
06/28/04
CM1206
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "
+
" character for the top side orientation mark
CM1206
16
3
2
5
4
1
B
A
D
C
Orientation
Marking
(see note 2)
120608
3
2
5
4
1
B
A
Orientation
Marking
(see note 2)
L06
3
2
1
B
A
Orientation
Marking
(see note 2)
C3
D3
C2
C1
D2
D1
C5
D5
C4
D4
A3
B3
A2
A1
B2
B1
A5
B5
A4
B4
A3
B3
A2
A1
B2
B1
A5
B5
A4
B4
A3
B3
A2
A1
B2
B1
CM1206-04
CSP Package
PACKAGE / PINOUT DIAGRAMS
Notes:
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
CM1206-08
CSP Package
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
CSP Package
CM1206-16
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PART NUMBERING INFORMATION
Bumps
Package
Standard Finish
Lead-free Finish
2
Ordering Part
Number
1
Part Marking
Ordering Part
Number
1
Part Marking
6
CSP
CM1206-04CS
L06
CM1206-04CP
L06
10
CSP
CM1206-08CS
120608
CM1206-08CP
120608
20
CSP
CM1206-16CS
CM120616
CM1206-16CP
CM120616
2004 California Micro Devices Corp. All rights reserved.
06/28/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
3
CM1206
Specifications
Note 1: T
A
=25
C unless otherwise specified. GND in this document refers to the lower supply voltage.
Note 2: ESD applied to channel pins with respect to GND, one at a time. All other channels are open. All GND pins tied to ground.
Note 3: These parameters are guaranteed by design and characterization.
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
Storage Temperature Range
-65 to +150
C
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
C
ELECTRICAL OPERATING CHARACTERISTICS
(NOTE 1)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
V
REV
Reverse Standoff Voltage
I
DIODE
=10
A
5.9
V
I
LEAK
Leakage Current
V
IN
=3.3V DC
100
nA
V
SIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
I
LOAD
= 10mA
6.0
-9.2
7.6
-7.6
9.2
-6.0
V
V
V
ESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Notes 2 & 3
+30
+18
kV
kV
V
CL
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Notes 2 & 3
+14
-14
V
V
C
Channel Capacitance
At 2.5V DC, f = 1MHz
39
47
pF
2004 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
06/28/04
CM1206
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
Figure 1. Recommended Non-Solder Mask Defined Pad Illustration
Figure 2. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 3. Lead-free (SnAgCu) Solder
Ball Reflow Profile
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.300mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.350mm Round
Solder Stencil Thickness
0.125 - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.360mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance -- Edge To Corner Ball
+50
m
Solder Ball Side Coplanarity
+20
m
Maximum Dwell Time Above Liquidous
60 seconds
Soldering Maximum Temperature
260C
Solder Mask Opening
0.350mm DIA.
Non-Solder Mask Defined Pad
0.300mm DIA.
Solder Stencil Opening
0.360mm DIA.
200
250
150
100
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
T
emperature
(
C)
2004 California Micro Devices Corp. All rights reserved.
06/28/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
5
CM1206
Mechanical Details
The CM1206 devices are packaged in custom Chip
Scale Packages (CSP).
CM1206-04 6-bump CSP Mechanical Specifications
The CM1206-04 devices are packaged in a 6-bump
custom Chip Scale Package (CSP). Dimensions are
presented below.
Package Dimensions for
CM1206-04 6-bump Chip Scale Package
CSP Tape and Reel Specifications
Figure 4. Tape and Reel Mechanical Data
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
6
Dim
Millimeters
Inches
Min
Nom
Max
Min
Nom
Max
A1
1.109
1.154
1.199
0.0437
0.0454
0.0472
A2
1.759
1.804
1.849
0.0693
0.0710
0.0728
B1
0.645
0.650
0.655
0.0254
0.0256
0.0258
B2
0.645
0.650
0.655
0.0254
0.0256
0.0258
B3
0.645
0.650
0.655
0.0254
0.0256
0.0258
C1
0.202
0.252
0.302
0.0080
0.0099
0.0119
C2
0.202
0.252
0.302
0.0080
0.0099
0.0119
D1
0.638
0.707
0.776
0.0251
0.0278
0.0306
D2
0.394
0.445
0.495
0.0155
0.0175
0.0195
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
1
2
3
B
C1
B1
A1
B2
C2
DIMENSIONS IN MILLIMETERS
D1
D2
A2
BOTTOM VIEW
SIDE
VIEW
A
B3
0.35 DIA.
63/37 Sn/Pb (Eutectic) or
SOLDER BUMPS
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
OptiGuard
TM
Coating
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B
0
X A
0
X K
0
TAPE WIDTH
W
REEL
DIA.
QTY
PER
REEL
P
0
P
1
CM1206-04
1.804 X 1.154 X 0.707
1.98 X 1.32 X 0.91
8mm
178mm (7")
3500
4mm
4mm
Top
For tape feeder reference
Cover
Tape
P
1
only including draft.
Concentric around B.
K
o
Embossment
User Direction of Feed
0.2 mm
P
o
Center Lines
of Cavity
W
10 Pitches Cumulative
Tolerance On Tape
A
o
B
o
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