electrostatic interference (EMI) shield for use with
circuits where sensitivity to EMI is critical. It was
designed to attenuate EMI by converting electromag-
netic field energy into heat that is absorbed by the
shield and by shunting electrostatic fields to common.
The 100MS may be used in applications to either
confine or exclude EMI. Its cavity was designed for
separate halves to maintain the electrical isolation
between the adjacent rows of pins of the module it
encloses. Because of the spacing between the shield
halves and epoxy flow holes, the 100MS provides a
partial, but adequate low reluctance path for electro-
magnetic flux. The 100MS is well suited for use with
isolation modules such as the Burr-Brown 3656, 722,
pins of the module through the beveled holes in the
base plate until the base plate and bottom of the
module are in contact with each other. Place the cover
slots in the base plate. Bend the four wide shield
soldering tabs protruding from the cover to make
contact with the bare metal on the base plate. Solder
these four tabs to insure the integrity of their connec-
tion to the base plate.
and secured to a printed circuit board (PCB) by solder-
ing the two narrow PCB solder tabs to the appropriate
common. The PCB solder tab closest to the input side
of the module should be soldered to the input com-
mon. The other tab should be soldered to the output
common. Figure 2 illustrates the assembly of the
no responsibility for the use of this information, and all use of such information shall be entirely at the user's own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
Using multiple devices within 30mm of each other can
cause them to interact by forming beat frequency interfer-
ence outputs. The 100MS can reduce this interference by as
much as a factor of 200:1 depending on the distance be-
tween the devices and their relative orientation.
paralleled as in Figure 3a.
sheet, or Appendix D of Burr-Brown IC Data Book.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
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information may not be available for release.
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parameters of each product is not necessarily performed.
their products and applications using TI components. To minimize the risks associated with customer products
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