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Datasheet: Am29LV200T-100 (Advanced Micro Systems)

2 Megabit (256 K X 8-bit/128 K X 16-bit) CMOS 3.0 Volt-only Boot Sector Flash Memory

 

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PRELIMINARY
Publication# 20513
Rev: D Amendment/+1
Issue Date: March 1998
Am29LV200
2 Megabit (256 K x 8-Bit/128 K x 16-Bit)
CMOS 3.0 Volt-only Boot Sector Flash Memory
DISTINCTIVE CHARACTERISTICS
s
Single power supply operation
-- Full voltage range: 2.7 to 3.6 volt read and write
operations for battery-powered applications
-- Regulated voltage range: 3.0 to 3.6 volt read and
write operations and for compatibility with high
performance 3.3 volt microprocessors
s
High performance
-- Full voltage range: access times as fast as 100
ns
-- Regulated voltage range: access times as fast as
90 ns
s
Ultra low power consumption (typical values at 5
MHz)
-- 200 nA Automatic Sleep mode current
-- 200 nA standby mode current
-- 10 mA read current
-- 20 mA program/erase current
s
Flexible sector architecture
-- One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and
three 64 Kbyte sectors (byte mode)
-- One 8 Kword, two 4 Kword, one 16 Kword, and
three 32 Kword sectors (word mode)
-- Supports full chip erase
-- Sector Protection features:
A hardware method of locking a sector to prevent
any program or erase operations within that
sector
Sectors can be locked via programming
equipment
Temporary Sector Unprotect feature allows code
changes in previously locked sectors
s
Top or bottom boot block configurations
available
s
Embedded Algorithms
-- Embedded Erase algorithm automatically
preprograms and erases the entire chip or any
combination of designated sectors
-- Embedded Program algorithm automatically
writes and verifies data at specified addresses
s
Typical 1,000,000 write cycles per sector
(100,000 cycles minimum guaranteed)
s
Package option
-- 48-pin TSOP
-- 44-pin SO
s
Compatibility with JEDEC standards
-- Pinout and software compatible with single-
power supply Flash
-- Superior inadvertent write protection
s
Data# Polling and toggle bits
-- Provides a software method of detecting program
or erase operation completion
s
Ready/Busy# pin (RY/BY#)
-- Provides a hardware method of detecting
program or erase cycle completion
s
Erase Suspend/Erase Resume
-- Suspends an erase operation to read data from,
or program data to, a sector that is not being
erased, then resumes the erase operation
s
Hardware reset pin (RESET#)
-- Hardware method to reset the device to reading
array data
Am29LV200
2
P R E L I M I N A R Y
GENERAL DESCRIPTION
The Am29LV200 is a 2 Mbit, 3.0 volt-only Flash
memory organized as 262,144 bytes or 131,072 words.
The device is offered in 44-pin SO and 48-pin TSOP
packages. The word-wide data (x16) appears on
DQ15DQ0; the byte-wide (x8) data appears on DQ7
DQ0. This device is designed to be programmed in-
system using only a single 3.0 volt V
CC
supply. No V
PP
is required for write or erase operations. The device
can also be programmed in standard EPROM pro-
grammers.
The standard device offers access times of 90, 100,
120, and 150 ns, allowing high speed microprocessors
to operate without wait states. To eliminate bus conten-
tion the device has separate chip enable (CE#), write
enable (WE#) and output enable (OE#) controls.
The device requires only a single 3.0 volt power sup-
ply
for both read and write functions. Internally gener-
ated and regulated voltages are provided for the
program and erase operations.
The device is entirely command set compatible with the
JEDEC single-power-supply Flash standard. Com-
mands are written to the command register using
standard microprocessor write timings. Register con-
tents serve as input to an internal state-machine that
controls the erase and programming circuitry. Write
cycles also internally latch addresses and data needed
for the programming and erase operations. Reading
data out of the device is similar to reading from other
Flash or EPROM devices.
Device programming occurs by executing the program
command sequence. This initiates the Embedded
Program
algorithm--an internal algorithm that auto-
matically times the program pulse widths and verifies
proper cell margin.
Device erasure occurs by executing the erase com-
mand sequence. This initiates the Embedded Erase
algorithm--an internal algorithm that automatically pre-
programs the array (if it is not already programmed) be-
fore executing the erase operation. During erase, the
device automatically times the erase pulse widths and
verifies proper cell margin.
The host system can detect whether a program or
erase operation is complete by observing the RY/BY#
pin, or by reading the DQ7 (Data# Polling) and DQ6
(toggle) status bits. After a program or erase cycle
has been completed, the device is ready to read array
data or accept another command.
The sector erase architecture allows memory sectors
to be erased and reprogrammed without affecting the
data contents of other sectors. The device is fully
erased when shipped from the factory.
Hardware data protection measures include a low
V
CC
detector that automatically inhibits write opera-
tions during power transitions. The hardware sector
protection
feature disables both program and erase
operations in any combination of the sectors of mem-
ory. This can be achieved via programming equipment.
The Erase Suspend feature enables the user to put
erase on hold for any period of time to read data from,
or program data to, any sector that is not selected for
erasure. True background erase can thus be achieved.
The hardware RESET# pin terminates any operation
in progress and resets the internal state machine to
reading array data. The RESET# pin may be tied to the
system reset circuitry. A system reset would thus also
reset the device, enabling the system microprocessor
to read the boot-up firmware from the Flash memory.
The device offers two power-saving features. When
addresses have been stable for a specified amount of
time, the device enters the automatic sleep mode.
The system can also place the device into the standby
mode
. Power consumption is greatly reduced in both
these modes.
AMD's Flash technology combines years of Flash
memory manufacturing experience to produce the
highest levels of quality, reliability and cost effective-
ness. The device electrically erases all bits within
a sector simultaneously via Fowler-Nordheim tun-
neling. The data is programmed using hot electron
injection.
3
Am29LV200
P R E L I M I N A R Y
PRODUCT SELECTOR GUIDE
Note: See "AC Characteristics" for full specifications.
BLOCK DIAGRAM
Family Part Number
Am29LV200
Speed Options
Regulated Voltage Range: V
CC
=3.03.6 V
-90R
Full Voltage Range: V
CC
= 2.73.6 V
-100
-120
-150
Max access time, ns (t
ACC
)
90
100
120
150
Max CE# access time, ns (t
CE
)
90
100
120
150
Max OE# access time, ns (t
OE
)
40
40
50
55
Input/Output
Buffers
X-Decoder
Y-Decoder
Chip Enable
Output Enable
Logic
Erase Voltage
Generator
PGM Voltage
Generator
Timer
V
CC
Detector
State
Control
Command
Register
V
CC
V
SS
WE#
BYTE#
CE#
OE#
STB
STB
DQ0
DQ15 (A-1)
Sector Switches
RY/BY#
RESET#
Data
Latch
Y-Gating
Cell Matrix
A
ddr
ess
La
tch
A0A16
20513D-1
Am29LV200
4
P R E L I M I N A R Y
CONNECTION DIAGRAMS
A1
A15
NC
A14
A13
A12
A11
A10
A9
A8
NC
NC
WE#
RESET#
NC
NC
RY/BY#
NC
A7
A6
A5
A4
A3
A2
1
16
2
3
4
5
6
7
8
17
18
19
20
21
22
23
24
9
10
11
12
13
14
15
A16
DQ2
BYTE#
V
SS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ9
DQ1
DQ8
DQ0
OE#
V
SS
CE#
A0
DQ5
DQ12
DQ4
V
CC
DQ11
DQ3
DQ10
48
33
47
46
45
44
43
42
41
40
39
38
37
36
35
34
25
32
31
30
29
28
27
26
A1
A15
NC
A14
A13
A12
A11
A10
A9
A8
NC
NC
WE#
RESET#
NC
NC
RY/BY#
NC
A7
A6
A5
A4
A3
A2
1
16
2
3
4
5
6
7
8
17
18
19
20
21
22
23
24
9
10
11
12
13
14
15
A16
DQ2
BYTE#
V
SS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ9
DQ1
DQ8
DQ0
OE#
V
SS
CE#
A0
DQ5
DQ12
DQ4
V
CC
DQ11
DQ3
DQ10
48
33
47
46
45
44
43
42
41
40
39
38
37
36
35
34
25
32
31
30
29
28
27
26
20513D-2
Reverse TSOP
Standard TSOP
5
Am29LV200
P R E L I M I N A R Y
CONNECTION DIAGRAMS
PIN CONFIGURATION
A0A16
=
17 addresses
DQ0DQ14 =
15 data inputs/outputs
DQ15/A-1
=
DQ15 (data input/output, word mode),
A-1 (LSB address input, byte mode)
BYTE#
=
Selects 8-bit or 16-bit mode
CE#
=
Chip enable
OE#
= Output
enable
WE#
=
Write enable
RESET#
=
Hardware reset pin, active low
RY/BY#
= Ready/Busy# output
V
CC
=
3.0 volt-only single power supply
(see Product Selector Guide for speed
options and voltage supply tolerances)
V
SS
=
Device ground
NC
=
Pin not connected internally
LOGIC SYMBOL
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
NC
RY/BY#
NC
A7
A6
A5
A4
A3
A2
A1
A0
CE#
V
SS
OE#
DQ0
DQ8
DQ1
DQ9
DQ2
DQ10
DQ3
DQ11
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
RESET#
WE#
A8
A9
A10
A11
A12
A13
A14
A15
A16
BYTE#
V
SS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
V
CC
SO
20513D-3
20513D-4
17
16 or 8
DQ0DQ15
(A-1)
A0A16
CE#
OE#
WE#
RESET#
BYTE#
RY/BY#
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